Part Details for SAC57D54HCVMOR by NXP Semiconductors
Overview of SAC57D54HCVMOR by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for SAC57D54HCVMOR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
11AC3864
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Newark | Arm 32-Bit Mcu, Triple Core, 4Mb Flash, 1.3Mb Gram, 1Mb Sysram, -40/+105Degc, 516 Mapbga/ Reel Rohs Compliant: Yes |Nxp SAC57D54HCVMOR Min Qty: 500 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$33.5600 | Buy Now |
|
DISTI #
SAC57D54HCVMOR-ND
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DigiKey | IC MCU 32BIT 4MB FLASH 516MAPBGA Min Qty: 500 Lead time: 16 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$35.8800 | Buy Now |
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DISTI #
SAC57D54HCVMOR
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Avnet Americas | SAC57D54HCVMO/BGA516/REEL 13 - Tape and Reel (Alt: SAC57D54HCVMOR) Min Qty: 500 Package Multiple: 500 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
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$30.5908 / $35.2781 | Buy Now |
|
DISTI #
841-SAC57D54HCVMOR
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Mouser Electronics | ARM Microcontrollers - MCU ARM 32-bit MCU, Triple core, 4MB Flash, 1.3MB gRAM, 1MB sysRAM, -40/+105degC, 516 MAPBGA RoHS: Compliant | 0 |
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$34.3300 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 500 Package Multiple: 500 Container: Reel | 0Reel |
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$37.9600 | Buy Now |
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DISTI #
SAC57D54HCVMOR
|
Avnet Americas | SAC57D54HCVMO/BGA516/REEL 13 - Tape and Reel (Alt: SAC57D54HCVMOR) Min Qty: 500 Package Multiple: 500 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
|
$30.5908 / $35.2781 | Buy Now |
Part Details for SAC57D54HCVMOR
SAC57D54HCVMOR CAD Models
SAC57D54HCVMOR Part Data Attributes:
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SAC57D54HCVMOR
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
SAC57D54HCVMOR
NXP Semiconductors
RISC Microcontroller
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | MABGA-516 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | CORTEX-A5/M4/M0 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| Format | FLOATING-POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B516 | |
| JESD-609 Code | e2 | |
| Length | 27 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 32 | |
| Number of External Interrupts | 1 | |
| Number of Serial I/Os | ||
| Number of Terminals | 516 | |
| Number of Timers | 7 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA516,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 2411724 | |
| ROM (words) | 4194304 | |
| ROM Programmability | FLASH | |
| Screening Level | ISO 26262 | |
| Seated Height-Max | 2.02 mm | |
| Speed | 320 MHz | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.2 V | |
| Supply Voltage-Nom | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |