Part Details for SIDC01D60C8X1SA2 by Infineon Technologies AG
Overview of SIDC01D60C8X1SA2 by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Not Available)
- Reference Designs: (Not Available)
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Price & Stock for SIDC01D60C8X1SA2
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SIDC01D60C8X1SA2
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Avnet Americas | DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC01D60C8X1SA2) RoHS: Not Compliant Min Qty: 143982 Package Multiple: 1 Lead time: 20 Weeks, 0 Days Container: Waffle Pack | 0 |
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$0.1834 / $0.2096 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 143982 Package Multiple: 1 Lead time: 20 Weeks | 0 |
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$0.1638 | Buy Now |