Part Details for SP5748GBK0AMMN6R by NXP Semiconductors
Overview of SP5748GBK0AMMN6R by NXP Semiconductors
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Price & Stock for SP5748GBK0AMMN6R
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SP5748GBK0AMMN6R-ND
|
DigiKey | IC MCU 32BIT 6MB FLASH 324MAPBGA Min Qty: 500 Lead time: 52 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
|
$41.5231 | Buy Now |
DISTI #
SP5748GBK0AMMN6R
|
Avnet Americas | TRIPLE CORE, 6M FLASH - Tape and Reel (Alt: SP5748GBK0AMMN6R) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 52 Weeks, 0 Days Container: Reel | 0 |
|
$35.4020 / $40.8265 | Buy Now |
DISTI #
771-SP5748GBK0AMMN6R
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Mouser Electronics | 32-bit Microcontrollers - MCU TRIPLE CORE, 6M FLASH, 768K RAM RoHS: Compliant | 0 |
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$39.2500 | Order Now |
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 500 Package Multiple: 500 Container: Reel | 0Reel |
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$43.9300 | Buy Now |
DISTI #
SP5748GBK0AMMN6R
|
Avnet Americas | TRIPLE CORE, 6M FLASH - Tape and Reel (Alt: SP5748GBK0AMMN6R) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 52 Weeks, 0 Days Container: Reel | 0 |
|
$35.4020 / $40.8265 | Buy Now |
DISTI #
SP5748GBK0AMMN6R
|
Avnet Americas | TRIPLE CORE, 6M FLASH - Tape and Reel (Alt: SP5748GBK0AMMN6R) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 52 Weeks, 0 Days Container: Reel | 0 |
|
$35.4020 / $40.8265 | Buy Now |
Part Details for SP5748GBK0AMMN6R
SP5748GBK0AMMN6R CAD Models
SP5748GBK0AMMN6R Part Data Attributes
|
SP5748GBK0AMMN6R
NXP Semiconductors
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Datasheet
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SP5748GBK0AMMN6R
NXP Semiconductors
RISC Microcontroller
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | MABGA-324 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 52 Weeks | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
Boundary Scan | YES | |
CPU Family | E200 | |
Clock Frequency-Max | 40 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | ||
Format | FLOATING-POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B324 | |
JESD-609 Code | e2 | |
Length | 19 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 32 | |
Number of External Interrupts | 1 | |
Number of Serial I/Os | 3 | |
Number of Terminals | 324 | |
Number of Timers | 19 | |
On Chip Data RAM Width | 8 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA324,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (bytes) | 786432 | |
ROM (words) | 6291456 | |
ROM Programmability | FLASH | |
Screening Level | ISO 26262 | |
Seated Height-Max | 1.7 mm | |
Speed | 160 MHz | |
Supply Current-Max | 400 mA | |
Supply Voltage-Max | 1.32 V | |
Supply Voltage-Min | 1.08 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 19 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |