Part Details for SPAK56F807VF80 by Motorola Semiconductor Products
Overview of SPAK56F807VF80 by Motorola Semiconductor Products
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Applications
Consumer Electronics
Internet of Things (IoT)
Automotive
Price & Stock for SPAK56F807VF80
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | 16-BIT DIGITAL SIGNAL PROCESSOR Digital Signal Processor, 16-Ext Bit, 80MHz, CMOS, PBGA160 RoHS: Not Compliant | Europe - 10 |
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RFQ |
Part Details for SPAK56F807VF80
SPAK56F807VF80 CAD Models
SPAK56F807VF80 Part Data Attributes
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SPAK56F807VF80
Motorola Semiconductor Products
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Datasheet
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SPAK56F807VF80
Motorola Semiconductor Products
Digital Signal Processor, 16-Ext Bit, 80MHz, CMOS, PBGA160, MOLD ARRAY PROCESS, BGA-160
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MOTOROLA INC | |
| Package Description | BGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 16 | |
| Barrel Shifter | YES | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 80 MHz | |
| External Data Bus Width | 16 | |
| Format | FIXED POINT | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PBGA-B160 | |
| Length | 15 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 160 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, CONTROLLER |