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Freescale 32-bit MCU, Power Arch core, 1.5MB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 144
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SPC5517EBMLQ66
Freescale Semiconductor
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SPC5517EBMLQ66
Freescale Semiconductor
Freescale 32-bit MCU, Power Arch core, 1.5MB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 144
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | QFP | |
Package Description | 20 X 20 MM, 1.40 MM HEIGHT, 0.5MM PITCH, ROHS COMPLIANT, LQFP-144 | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | 23 | |
Bit Size | 32 | |
CPU Family | E200 | |
Clock Frequency-Max | 40 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | 23 | |
JESD-30 Code | S-PQFP-G144 | |
JESD-609 Code | e3 | |
Length | 20 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 111 | |
Number of Terminals | 144 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP144,.87SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 81920 | |
ROM (words) | 196608 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.6 mm | |
Speed | 66 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 20 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |