Part Details for SPC5643AF0MVZ2 by Freescale Semiconductor
Overview of SPC5643AF0MVZ2 by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for SPC5643AF0MVZ2
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | MPC5643A - ANDORRA 4M-NXP 32-bit MCU, Power Architecture core, 3MB Flash RoHS: Compliant Status: Active Min Qty: 1 | 92 |
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$29.3200 / $34.4900 | Buy Now |
Part Details for SPC5643AF0MVZ2
SPC5643AF0MVZ2 CAD Models
SPC5643AF0MVZ2 Part Data Attributes
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SPC5643AF0MVZ2
Freescale Semiconductor
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Datasheet
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SPC5643AF0MVZ2
Freescale Semiconductor
Freescale 32-bit MCU, Power Arch core, 3MB Flash, 120MHz, -40/+125degC, Automotive Grade, PBGA 324
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, LEAD FREE, MS-034AAJ-1, TEPBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Bit Size | 32 | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e2 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 196608 | |
| ROM (words) | 3145728 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100 | |
| Speed | 120 MHz | |
| Supply Current-Max | 400 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |