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SPC56AP60L3CEFAY by:

32-bit Power Architecture MCU for Automotive Chassis and Safety Applications

Part Details for SPC56AP60L3CEFAY by STMicroelectronics

Overview of SPC56AP60L3CEFAY by STMicroelectronics

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Applications Industrial Automation Transportation and Logistics Renewable Energy Automotive Robotics and Drones

Price & Stock for SPC56AP60L3CEFAY

Part # Distributor Description Stock Price Buy
DISTI # SPC56AP60L3CEFAY-ND
DigiKey IC MCU 32BIT 1MB FLASH 100LQFP Lead time: 98 Weeks Container: Tray Temporarily Out of Stock
Buy Now
DISTI # SPC56AP60L3CEFAY
Avnet Americas MCU 32-Bit SPC56AP60x e200z0h RISC 1024KB Flash 5V 100-Pin LQFP Tray - Trays (Alt: SPC56AP60L3CEFAY) RoHS: Compliant Min Qty: 540 Package Multiple: 540 Container: Tray 0
RFQ

Part Details for SPC56AP60L3CEFAY

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SPC56AP60L3CEFAY Part Data Attributes:

SPC56AP60L3CEFAY STMicroelectronics
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SPC56AP60L3CEFAY STMicroelectronics 32-bit Power Architecture MCU for Automotive Chassis and Safety Applications
Part Life Cycle Code Active
Ihs Manufacturer STMICROELECTRONICS
Reach Compliance Code compliant
HTS Code 8542.31.00.01
JESD-30 Code S-PQFP-G100
Length 14 mm
Number of Terminals 100
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm
uPs/uCs/Peripheral ICs Type SOC

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