Part Details for SPC5748GK1MMN6 by NXP Semiconductors
Overview of SPC5748GK1MMN6 by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Robotics and Drones
Price & Stock for SPC5748GK1MMN6
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
63Y5362
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Newark | Nxp 32-Bit Mcu, Triple Core, 6Mb Flash, 160Mhz, -40/+125Degc, Automotive Qualified, 324 Mapbga/Tray Rohs Compliant: Yes |Nxp SPC5748GK1MMN6 Min Qty: 84 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$33.0800 / $38.6000 | Buy Now |
|
DISTI #
SPC5748GK1MMN6-ND
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DigiKey | IC MCU 32BIT 6MB FLASH 324MAPBGA Lead time: 52 Weeks Container: Bulk | Limited Supply - Call |
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Buy Now | |
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DISTI #
SPC5748GK1MMN6
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Avnet Americas | MCU 32-Bit MPC57xx e200Z4 RISC 6MB Flash 1.2V/3.3V/5V 324-Pin MAPBGA Tray - Trays (Alt: SPC5748GK1MMN6) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Container: Tray | 0 |
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RFQ | |
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DISTI #
SPC5748GK1MMN6
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EBV Elektronik | MCU 32-Bit MPC57xx e200Z4 RISC 6MB Flash 1.2V/3.3V/5V 324-Pin MAPBGA Tray (Alt: SPC5748GK1MMN6) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 54 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for SPC5748GK1MMN6
SPC5748GK1MMN6 CAD Models
SPC5748GK1MMN6 Part Data Attributes
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SPC5748GK1MMN6
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
SPC5748GK1MMN6
NXP Semiconductors
IC MCU 32BIT 6MB FLASH 324MAPBGA
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | MAPBGA-324 | |
| Reach Compliance Code | compliant | |
| Has ADC | YES | |
| Additional Feature | EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B324 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 324 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 786432 | |
| ROM (words) | 6291456 | |
| ROM Programmability | FLASH | |
| Screening Level | ISO 26262 | |
| Seated Height-Max | 1.7 mm | |
| Speed | 160 MHz | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.08 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |