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Overview of STM32F103RDY6 by STMicroelectronics
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for STM32F103RDY6 by STMicroelectronics
Part Data Attributes for STM32F103RDY6 by STMicroelectronics
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
STMICROELECTRONICS
|
Part Package Code
|
CSP
|
Package Description
|
WLCSP-64
|
Pin Count
|
64
|
Reach Compliance Code
|
compliant
|
Bit Size
|
32
|
CPU Family
|
CORTEX-M3
|
JESD-30 Code
|
S-PBGA-B64
|
Number of Terminals
|
64
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
FBGA
|
Package Equivalence Code
|
BGA64,8X8,20
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, FINE PITCH
|
Power Supplies
|
2.5/3.3 V
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
65536
|
ROM (words)
|
393216
|
ROM Programmability
|
FLASH
|
Speed
|
72 MHz
|
Supply Current-Max
|
70 mA
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
BOTTOM
|
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