Part Details for SVF311R3K2CKU2 by NXP Semiconductors
Overview of SVF311R3K2CKU2 by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for SVF311R3K2CKU2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
568-15005-ND
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DigiKey | IC MPU VYBRID 266MHZ 176HLQFP Min Qty: 1 Lead time: 18 Weeks Container: Tray |
40 In Stock |
|
$21.1773 / $26.7000 | Buy Now |
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DISTI #
SVF311R3K2CKU2
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Avnet Americas | SVF311R3K2CKU2/HLQFP176/STANDA - Trays (Alt: SVF311R3K2CKU2) RoHS: Compliant Min Qty: 160 Package Multiple: 40 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
|
$21.0078 / $24.2268 | Buy Now |
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DISTI #
771-SVF311R3K2CKU2
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Mouser Electronics | Microprocessors - MPU Vybrid R 32-bit MPU, ARM Cortex-A5 core, ARM Cortex-M4 core, QFP 176 | 0 |
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$21.1700 / $26.7000 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 160 Package Multiple: 40 Lead time: 18 Weeks Container: Tray | 0Tray |
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$22.5900 | Buy Now |
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Rochester Electronics | VF3xxR - 1.5M M4 A5-266 Open VG RoHS: Compliant Status: Active Min Qty: 1 | 40 |
|
$23.1000 / $27.1800 | Buy Now |
Part Details for SVF311R3K2CKU2
SVF311R3K2CKU2 CAD Models
SVF311R3K2CKU2 Part Data Attributes
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SVF311R3K2CKU2
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
SVF311R3K2CKU2
NXP Semiconductors
IC MCU 32BIT ROMLESS 176LQFP
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HLFQFP, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | ||
| Boundary Scan | YES | |
| External Data Bus Width | ||
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PQFP-G176 | |
| JESD-609 Code | e3 | |
| Length | 24 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 176 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.6 mm | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.16 V | |
| Supply Voltage-Nom | 1.23 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 24 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |