Datasheets
SVF532R2K1CMK4 by:

RISC PROCESSOR

Part Details for SVF532R2K1CMK4 by NXP Semiconductors

Overview of SVF532R2K1CMK4 by NXP Semiconductors

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Applications Industrial Automation

Price & Stock for SVF532R2K1CMK4

Part # Distributor Description Stock Price Buy
DISTI # 51Y5631
Newark Vfxxx R Cortex- M4 Primary Core, Cortex A5, L2 Cache, Openvg Gpu, 364 Bga Package/ Tray Rohs Compliant: Yes |Nxp SVF532R2K1CMK4 RoHS: Compliant Min Qty: 450 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 250 $33.4600
$33.4600 Buy Now
DISTI # SVF532R2K1CMK4-ND
DigiKey IC MPU VYBRID 133MHZ 364LFBGA Min Qty: 450 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 450 $30.7481
$30.7481 Buy Now
DISTI # SVF532R2K1CMK4
Avnet Americas MPU Vybrid R RISC 32-Bit 400MHz 364-Pin MAPBGA Tray - Trays (Alt: SVF532R2K1CMK4) RoHS: Compliant Min Qty: 450 Package Multiple: 450 Lead time: 13 Weeks, 0 Days Container: Tray 0
  • 450 $27.0584
$27.0584 Buy Now
DISTI # 841-SVF532R2K1CMK4
Mouser Electronics Microprocessors - MPU VFxxx R Cortex- M4 Primary core, Cortex A5, L2 Cache, OpenVG GPU, 364 BGA package RoHS: Compliant 0
  • 450 $34.3700
$34.3700 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 450 Package Multiple: 450 Lead time: 13 Weeks Container: Tray 0
Tray
  • 450 $32.8000
$32.8000 Buy Now
Flip Electronics Stock 90
RFQ

Part Details for SVF532R2K1CMK4

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SVF532R2K1CMK4 Part Data Attributes

SVF532R2K1CMK4 NXP Semiconductors
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SVF532R2K1CMK4 NXP Semiconductors RISC PROCESSOR
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 17 X 17 MM, 1.50 MM HEIGHT, 0.80 MM PITCH, BGA-364
Reach Compliance Code compliant
ECCN Code 5A992.C
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Address Bus Width
Boundary Scan YES
External Data Bus Width
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B364
JESD-609 Code e1
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 364
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Speed 400 MHz
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.16 V
Supply Voltage-Nom 1.23 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

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