Part Details for SVF532R2K1CMK4 by NXP Semiconductors
Overview of SVF532R2K1CMK4 by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Price & Stock for SVF532R2K1CMK4
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
51Y5631
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Newark | Vfxxx R Cortex- M4 Primary Core, Cortex A5, L2 Cache, Openvg Gpu, 364 Bga Package/ Tray Rohs Compliant: Yes |Nxp SVF532R2K1CMK4 RoHS: Compliant Min Qty: 450 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$33.4600 | Buy Now |
DISTI #
SVF532R2K1CMK4-ND
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DigiKey | IC MPU VYBRID 133MHZ 364LFBGA Min Qty: 450 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$30.7481 | Buy Now |
DISTI #
SVF532R2K1CMK4
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Avnet Americas | MPU Vybrid R RISC 32-Bit 400MHz 364-Pin MAPBGA Tray - Trays (Alt: SVF532R2K1CMK4) RoHS: Compliant Min Qty: 450 Package Multiple: 450 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$27.0584 | Buy Now |
DISTI #
841-SVF532R2K1CMK4
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Mouser Electronics | Microprocessors - MPU VFxxx R Cortex- M4 Primary core, Cortex A5, L2 Cache, OpenVG GPU, 364 BGA package RoHS: Compliant | 0 |
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$34.3700 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 450 Package Multiple: 450 Lead time: 13 Weeks Container: Tray | 0Tray |
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$32.8000 | Buy Now |
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Flip Electronics | Stock | 90 |
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RFQ |
Part Details for SVF532R2K1CMK4
SVF532R2K1CMK4 CAD Models
SVF532R2K1CMK4 Part Data Attributes
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SVF532R2K1CMK4
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
SVF532R2K1CMK4
NXP Semiconductors
RISC PROCESSOR
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 17 X 17 MM, 1.50 MM HEIGHT, 0.80 MM PITCH, BGA-364 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 13 Weeks | |
Samacsys Manufacturer | NXP | |
Address Bus Width | ||
Boundary Scan | YES | |
External Data Bus Width | ||
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B364 | |
JESD-609 Code | e1 | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 364 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Speed | 400 MHz | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.16 V | |
Supply Voltage-Nom | 1.23 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |