Part Details for T1024NXN7KQA by NXP Semiconductors
Overview of T1024NXN7KQA by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for T1024NXN7KQA
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
56Y1792
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Newark | Qoriq, 2Xcpu 64-Bit Pwr Arch, 1.0Ghz, Ddr3L/4, Pcie, 1/10Gbe, Hw Accel, -40 To 105C, 23X23 Pkg/ Tray Rohs Compliant: Yes |Nxp T1024NXN7KQA Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$83.1000 / $88.2900 | Buy Now |
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DISTI #
T1024NXN7KQA-ND
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DigiKey | IC MPU QORIQ T1 1GHZ 780FBGA Min Qty: 60 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
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$96.3797 | Buy Now |
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DISTI #
T1024NXN7KQA
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Avnet Americas | MPU QorIQ RISC 64Bit 1000MHz 1.2V/1.8V 780-Pin FCP-BGA Box - Trays (Alt: T1024NXN7KQA) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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$80.4948 / $92.8287 | Buy Now |
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DISTI #
841-T1024NXN7KQA
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Mouser Electronics | Microprocessors - MPU QorIQ, 2xCPU 64-Bit Pwr Arch, 1.0GHz, DDR3L/4, PCIe, 1/10GbE, HW Accel, -40 to 105C, 23x23 pkg RoHS: Compliant | 0 |
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$92.0500 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks Container: Tray | 0Tray |
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$81.1500 | Buy Now |
Part Details for T1024NXN7KQA
T1024NXN7KQA CAD Models
T1024NXN7KQA Part Data Attributes
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T1024NXN7KQA
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
T1024NXN7KQA
NXP Semiconductors
64-BIT, 1000MHz, RISC PROCESSOR, PBGA780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HFBGA, BGA780,28X28,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B780 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 780 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFBGA | |
| Package Equivalence Code | BGA780,28X28,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| Seated Height-Max | 2.07 mm | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |