Part Details for THGBMHT0C8LBAIG by Toshiba America Electronic Components
Overview of THGBMHT0C8LBAIG by Toshiba America Electronic Components
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for THGBMHT0C8LBAIG
THGBMHT0C8LBAIG CAD Models
THGBMHT0C8LBAIG Part Data Attributes
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THGBMHT0C8LBAIG
Toshiba America Electronic Components
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Datasheet
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THGBMHT0C8LBAIG
Toshiba America Electronic Components
Memory Circuit, 128GX8, CMOS, PBGA153
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Package Description | FBGA-153 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Date Of Intro | 2017-01-11 | |
Samacsys Manufacturer | Toshiba | |
JESD-30 Code | R-PBGA-B153 | |
Memory Density | 1099511627776 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 153 | |
Number of Words | 137438953472 words | |
Number of Words Code | 128000000000 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Organization | 128GX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM |