Part Details for TJA1022TK by NXP Semiconductors
Overview of TJA1022TK by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Healthcare
Price & Stock for TJA1022TK
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | DUAL LIN 2.2/SAE J2602 TRANSCEIVER Interface Circuit, PDSO14 RoHS: Compliant |
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RFQ |
Part Details for TJA1022TK
TJA1022TK CAD Models
TJA1022TK Part Data Attributes
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TJA1022TK
NXP Semiconductors
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Datasheet
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TJA1022TK
NXP Semiconductors
DATACOM, INTERFACE CIRCUIT, PDSO14, 3 X 4.50 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, SOT1086-2, MO-229, HVSON-14
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HVSON, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | R-PDSO-N14 | |
| Length | 4.5 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 14 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Nom | 12 V | |
| Surface Mount | YES | |
| Telecom IC Type | INTERFACE CIRCUIT | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3 mm |
Alternate Parts for TJA1022TK
This table gives cross-reference parts and alternative options found for TJA1022TK. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TJA1022TK, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MCP201T-I/SN | DATACOM, INTERFACE CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | Microchip Technology Inc | TJA1022TK vs MCP201T-I/SN |
| TH8056KDC-AAA-014-TU | Interface Circuit, PDSO14, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-14 | Melexis Microelectronic Integrated Systems | TJA1022TK vs TH8056KDC-AAA-014-TU |
| MCP2022T-330E/ST | DATACOM, INTERFACE CIRCUIT, PDSO14, 4.40 MM, PLASTIC, TSSOP-14 | Microchip Technology Inc | TJA1022TK vs MCP2022T-330E/ST |
| TLE6262GNUMA1 | Interface Circuit, PDSO28, POWER, PLASTIC, SO-28 | Infineon Technologies AG | TJA1022TK vs TLE6262GNUMA1 |
| MCP2022-330E/P | DATACOM, INTERFACE CIRCUIT, PDIP14, 0.300 INCH, LEAD FREE, PLASTIC, DIP-14 | Microchip Technology Inc | TJA1022TK vs MCP2022-330E/P |
| MCP201T-E/SN | DATACOM, INTERFACE CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | Microchip Technology Inc | TJA1022TK vs MCP201T-E/SN |
| 935290083029 | DATACOM, INTERFACE CIRCUIT, UUC13, DIE-13 | NXP Semiconductors | TJA1022TK vs 935290083029 |
| MCP2022P-E/MF | DATACOM, INTERFACE CIRCUIT | Microchip Technology Inc | TJA1022TK vs MCP2022P-E/MF |
| MCP2022T-330E/SL | DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, LEAD FREE, PLASTIC, SOIC-14 | Microchip Technology Inc | TJA1022TK vs MCP2022T-330E/SL |
| 935290083027 | DATACOM, INTERFACE CIRCUIT, UUC13, DIE-13 | NXP Semiconductors | TJA1022TK vs 935290083027 |