Part Details for TMP86CH21UG by Toshiba America Electronic Components
Overview of TMP86CH21UG by Toshiba America Electronic Components
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for TMP86CH21UG
TMP86CH21UG CAD Models
TMP86CH21UG Part Data Attributes
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TMP86CH21UG
Toshiba America Electronic Components
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Datasheet
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TMP86CH21UG
Toshiba America Electronic Components
IC,MICROCONTROLLER,8-BIT,TLCS-870/C CPU,CMOS,QFP,64PIN,PLASTIC
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TOSHIBA CORP | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 8 | |
CPU Family | TLCS-870/C | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G64 | |
Length | 10 mm | |
Number of I/O Lines | 39 | |
Number of Terminals | 64 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP64,.47SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
RAM (bytes) | 512 | |
ROM (words) | 16384 | |
ROM Programmability | MROM | |
Speed | 16 MHz | |
Supply Current-Max | 9 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2.7 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 10 mm |