Datasheets
TMPM366FYXBG by: Toshiba America Electronic Components

IC RISC MICROCONTROLLER, Microcontroller

Part Details for TMPM366FYXBG by Toshiba America Electronic Components

Overview of TMPM366FYXBG by Toshiba America Electronic Components

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for TMPM366FYXBG

Part # Distributor Description Stock Price Buy
DISTI # TMPM366FYXBG-ND
DigiKey IC MCU 32BIT 256KB FLSH 109TFBGA Min Qty: 1 Lead time: 18 Weeks Container: Tray Limited Supply - Call
  • 1 $7.5400
  • 10 $5.0270
  • 25 $4.3688
  • 80 $3.7264
  • 230 $3.2864
  • 440 $3.0691
  • 945 $3.0625
$3.0625 / $7.5400 Buy Now
DISTI # TMPM366FYXBG
Avnet Americas Microcontrollers with a full-speed USB device achieve the optimal balance between the cost and performance.NANO FLASH - Trays (Alt: TMPM366FYXBG) RoHS: Compliant Min Qty: 200 Package Multiple: 200 Lead time: 18 Weeks, 0 Days Container: Tray 0
RFQ

Part Details for TMPM366FYXBG

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TMPM366FYXBG Part Data Attributes

TMPM366FYXBG Toshiba America Electronic Components
Buy Now Datasheet
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TMPM366FYXBG Toshiba America Electronic Components IC RISC MICROCONTROLLER, Microcontroller
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer TOSHIBA CORP
Package Description TFBGA, BGA109,12X12,25
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Factory Lead Time 18 Weeks
Has ADC YES
Address Bus Width
Bit Size 32
CPU Family CORTEX-M3
DAC Channels NO
DMA Channels YES
External Data Bus Width
Length 9 mm
Number of I/O Lines 74
Number of Terminals 109
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA109,12X12,25
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified
RAM (bytes) 49152
ROM (words) 262144
ROM Programmability FLASH
Speed 48 MHz
Supply Current-Max 50 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 2.7 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.65 mm
Terminal Position BOTTOM
Width 9 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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