Part Details for TMS27C256-1JL by Rochester Electronics LLC
Overview of TMS27C256-1JL by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Aerospace and Defense
Part Details for TMS27C256-1JL
TMS27C256-1JL CAD Models
TMS27C256-1JL Part Data Attributes
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TMS27C256-1JL
Rochester Electronics LLC
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Datasheet
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TMS27C256-1JL
Rochester Electronics LLC
UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28
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| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Package Description | 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 170 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 4.907 mm | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for TMS27C256-1JL
This table gives cross-reference parts and alternative options found for TMS27C256-1JL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS27C256-1JL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HN27C256G-17 | 32KX8 UVPROM, 170ns, CDIP28, CERDIP-28 | Renesas Electronics Corporation | TMS27C256-1JL vs HN27C256G-17 |
| SMJ27C256-17JM | 32KX8 UVPROM, 170ns, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 | Texas Instruments | TMS27C256-1JL vs SMJ27C256-17JM |
| TMS27C256-1JP4 | TMS27C256-1JP4 | Texas Instruments | TMS27C256-1JL vs TMS27C256-1JP4 |
| AS27C256-17JM | UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | TMS27C256-1JL vs AS27C256-17JM |
| M27256-1F1 | 32KX8 UVPROM, 170ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | STMicroelectronics | TMS27C256-1JL vs M27256-1F1 |
| AM27C256-170DE | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | TMS27C256-1JL vs AM27C256-170DE |
| HN27C256G-17 | UVPROM, 32KX8, 170ns, CMOS, CDIP28, CERDIP-28 | Hitachi Ltd | TMS27C256-1JL vs HN27C256G-17 |
| AM27C256-170DCB | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | TMS27C256-1JL vs AM27C256-170DCB |
| AT27C256R-17DM | UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Atmel Corporation | TMS27C256-1JL vs AT27C256R-17DM |
| AM27256-17DIB | UVPROM, 32KX8, 170ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | TMS27C256-1JL vs AM27256-17DIB |