There are no models available for this part yet.
Overview of TMS320VC5409AGWS12 by Texas Instruments
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for TMS320VC5409AGWS12 by Texas Instruments
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
296-TMS320VC5409AGWS12-ND
|
DigiKey | IC DSP FIXED PT 120 MIPS 144-BGA Min Qty: 160 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
|
$17.4035 | Buy Now | |
DISTI #
595-S320VC5409AGWS12
|
Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC Fixed-Point DSP 144-NFBGA -40 to 100 RoHS: Not Compliant | 156 |
|
$17.3600 / $23.0000 | Buy Now | |
Ameya Holding Limited | 1360 |
|
RFQ |
CAD Models for TMS320VC5409AGWS12 by Texas Instruments
Part Data Attributes for TMS320VC5409AGWS12 by Texas Instruments
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
TEXAS INSTRUMENTS INC
|
Package Description
|
LFBGA, BGA144,13X13,32
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
3A991.A.2
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HTS Code
|
8542.31.00.01
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Date Of Intro
|
2020-05-23
|
Samacsys Manufacturer
|
Texas Instruments
|
Address Bus Width
|
23
|
Barrel Shifter
|
YES
|
Bit Size
|
16
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
20 MHz
|
External Data Bus Width
|
16
|
Format
|
FIXED POINT
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Integrated Cache
|
NO
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Internal Bus Architecture
|
MULTIPLE
|
JESD-30 Code
|
S-PBGA-B144
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JESD-609 Code
|
e0
|
Length
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12 mm
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Low Power Mode
|
YES
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Moisture Sensitivity Level
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3
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Number of DMA Channels
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6
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Number of External Interrupts
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4
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Number of Terminals
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144
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Number of Timers
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1
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On Chip Data RAM Width
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16
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On Chip Program ROM Width
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16
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Operating Temperature-Max
|
100 °C
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Operating Temperature-Min
|
-40 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
LFBGA
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Package Equivalence Code
|
BGA144,13X13,32
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Package Shape
|
SQUARE
|
Package Style
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GRID ARRAY, LOW PROFILE, FINE PITCH
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Peak Reflow Temperature (Cel)
|
220
|
RAM (words)
|
32768
|
ROM Programmability
|
MROM
|
Seated Height-Max
|
1.4 mm
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Supply Voltage-Max
|
1.65 V
|
Supply Voltage-Min
|
1.42 V
|
Supply Voltage-Nom
|
1.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
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Terminal Pitch
|
0.8 mm
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Terminal Position
|
BOTTOM
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Time@Peak Reflow Temperature-Max (s)
|
20
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Width
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12 mm
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uPs/uCs/Peripheral ICs Type
|
DIGITAL SIGNAL PROCESSOR, OTHER
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