Part Details for TPS820 by Toshiba America Electronic Components

This reference design showcases various power architectures for generating multiple voltage rails for an application processor module: requiring >1A load current and high efficiency . The required power supply is generated using 5-: 12- or 24-V DC input from the backplane. Power supplies are generated using DC-DC converters with an integrated FET and a power module with an integrated inductor for size. The design features a HotRod™ package type for applications requiring low EMI. It is also optimal for design time constrained applications. Additional features include DDR termination regulator: input supply OR-ing: voltage sequencing: eFuse for overload protection: and voltage and load current monitoring. This design can be used with a  processor: digital signal processor and field-programmable gate array. It has been tested for radiated emission: per CISPR22 meeting class A and B requirements.

The TIDEP0028 Ethernet Powerlink development platform combines the AM335x Sitara processor family from Texas Instruments (TI) and the Powerlink open media access control (MAC) layer into a single system-on-chip (SoC) solution. Targeted for Ethernet Powerlink slave communications, the TIDEP0028 al

The TIDA-01051 reference design is used to demonstrate optimized channel density: integration: power consumption: clock distribution and signal chain performance of very high channel count data acquisition (DAQ) systems such as those used in automatic test equipment (ATE). Using serializers: such as TI’s DS90C383B: to combine many simultaneously sampling ADC outputs into several LVDS lines dramatically reduces the number of pins the host FPGA must process.  As a result: a single FPGA can process a significantly increased number of DAQ channels and board routing complexity is greatly reduced.

This reference design discusses the use and performance of the Digital Variable-Gain high-speed amplifier: the LMH6401: to drive the high-speed analog-to-digital converter (ADC): the ADS54J60 device. Different options for common-mode voltages: power supplies: and interfaces are discussed and measued: including AC-coupling and DC-coupling: to meet the requirements of a variety of applications.

The TSW40RF82EVM reference design provides a platform to interface the DAC38RF82 with a high-performance modulator - the TRF370417EVM. The TRF370417EVM can modulate wideband signals at up to 6 GHz as would be typical for a microwave backhaul application. The TRF370417 device may be substituted for a suitable higher-frequency device. Minimal modification is required to interface the digital-to-analog converter (DAC) with the modulator. This design provides the method to interface the TSW40RF82EVM with the TRF370417EVM.