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Microcontrollers and Processors / Microprocessors / TSPC603RVGH8LC
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TSPC603RVGH8LC by:

RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255

Part Details for TSPC603RVGH8LC by Atmel Corporation

Overview of TSPC603RVGH8LC by Atmel Corporation

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Part Details for TSPC603RVGH8LC

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TSPC603RVGH8LC Part Data Attributes

Parametric Data
TSPC603RVGH8LC Atmel Corporation
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TSPC603RVGH8LC Atmel Corporation RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255
Part Life Cycle Code Transferred
Ihs Manufacturer ATMEL CORP
Part Package Code BGA
Package Description 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255
Pin Count 255
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 66.7 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B255
Length 21 mm
Low Power Mode YES
Number of Terminals 255
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.08 mm
Speed 200 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSPC603RVGH8LC

This table gives cross-reference parts and alternative options found for TSPC603RVGH8LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC603RVGH8LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSPC603RVG8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RVG8LC
TSPC603RMGU8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RMGU8LC
TSXPC603RVGU8LC 32-BIT, 200MHz, RISC PROCESSOR, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RVGU8LC
TSXPC603RMGU8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RMGU8LC
TSPC603RVGU8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RVGU8LC
TSXPC603RMGH8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RMGH8LC
TSPC603RMGB/T8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RMGB/T8LC
TSXPC603RVGU/T8LC 32-BIT, 200MHz, RISC PROCESSOR, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RVGU/T8LC
TSPC603RMGH8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RMGH8LC
TSPC603RVGU/T8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RVGU/T8LC
Part Number Description Manufacturer Compare
WEDMC64603RV200CM RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 Microsemi Corporation TSPC603RVGH8LC vs WEDMC64603RV200CM
TS(X)PC603RVGU/T6L(C) RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 Thales Group TSPC603RVGH8LC vs TS(X)PC603RVGU/T6L(C)
TSPC740AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation TSPC603RVGH8LC vs TSPC740AMGSB/T12LE
TSXPC603RMGHU10LC RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSXPC603RMGHU10LC
TSXPC603EMGU3LN RISC Microprocessor, 32-Bit, 100MHz, CMOS, CBGA255, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSXPC603EMGU3LN
PCX740PMGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation TSPC603RVGH8LC vs PCX740PMGSU300LE
IBM25PPC740L-GB375A2T RISC Microprocessor, 32-Bit, 375MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 IBM TSPC603RVGH8LC vs IBM25PPC740L-GB375A2T
TSXPC603EMGB/T4MN RISC Microprocessor, 32-Bit, 120MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603EMGB/T4MN
TSPC603RVGH10LC RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RVGH10LC
PC740PMGSU333LE RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation TSPC603RVGH8LC vs PC740PMGSU333LE

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