Part Details for UPD44646363AF5-E25-FQ1-A by Renesas Electronics Corporation
Overview of UPD44646363AF5-E25-FQ1-A by Renesas Electronics Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for UPD44646363AF5-E25-FQ1-A
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | Standard SRAM, 2MX36, 0.45ns ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 1453 |
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$66.5300 / $78.2700 | Buy Now |
Part Details for UPD44646363AF5-E25-FQ1-A
UPD44646363AF5-E25-FQ1-A CAD Models
UPD44646363AF5-E25-FQ1-A Part Data Attributes
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UPD44646363AF5-E25-FQ1-A
Renesas Electronics Corporation
Buy Now
Datasheet
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UPD44646363AF5-E25-FQ1-A
Renesas Electronics Corporation
IC,SYNC SRAM,DDR,2MX36,CMOS,BGA,165PIN,PLASTIC
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Reach Compliance Code | unknown | |
| Factory Lead Time | 4 Weeks | |
| Access Time-Max | 0.45 ns | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| Memory Density | 75497472 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 36 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.48 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.73 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM |