Part Details for UPD46185364BF1-E40-EQ1-A by Renesas Electronics Corporation
Overview of UPD46185364BF1-E40-EQ1-A by Renesas Electronics Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Price & Stock for UPD46185364BF1-E40-EQ1-A
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-UPD46185364BF1-E40-EQ1-A-ND
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DigiKey | QDR SRAM, 512KX36, 0.45NS Min Qty: 7 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
565 In Stock |
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$45.5700 | Buy Now |
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Rochester Electronics | UPD46185364 - QDR SRAM, 512KX36 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 565 |
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$39.1100 / $46.0200 | Buy Now |
Part Details for UPD46185364BF1-E40-EQ1-A
UPD46185364BF1-E40-EQ1-A CAD Models
UPD46185364BF1-E40-EQ1-A Part Data Attributes:
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UPD46185364BF1-E40-EQ1-A
Renesas Electronics Corporation
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Datasheet
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UPD46185364BF1-E40-EQ1-A
Renesas Electronics Corporation
QDRII/DDRII/ QDRII+/DDRII+ SRAM, LBGA, /Tray
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | LBGA | |
Package Description | BGA-165 | |
Pin Count | 165 | |
Manufacturer Package Code | PLBG0165FJ | |
Reach Compliance Code | unknown | |
ECCN Code | 5A002 | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 0.45 ns | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e6 | |
Length | 15 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 36 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX36 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Seated Height-Max | 1.46 mm | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN BISMUTH | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |