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Part Details for UPD48576236F1-E24-DW1-A by Renesas Electronics Corporation
Overview of UPD48576236F1-E24-DW1-A by Renesas Electronics Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for UPD48576236F1-E24-DW1-A
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | UPD48576236F1-E24-DW1-A - 576M-BIT Low Latency DRAM Common I/O ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 521 |
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$64.9100 / $76.3700 | Buy Now |
Part Details for UPD48576236F1-E24-DW1-A
UPD48576236F1-E24-DW1-A CAD Models
UPD48576236F1-E24-DW1-A Part Data Attributes
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UPD48576236F1-E24-DW1-A
Renesas Electronics Corporation
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Datasheet
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UPD48576236F1-E24-DW1-A
Renesas Electronics Corporation
576M-BIT Low Latency DRAM Common I/O, TFBGA, /Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | TFBGA | |
| Package Description | TBGA, | |
| Pin Count | 144 | |
| Manufacturer Package Code | PTBG0144GC-A144 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002 | |
| HTS Code | 8542.32.00.32 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO REFRESH, TERM PITCH-MAX | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 2,4,8 | |
| JESD-30 Code | R-PBGA-B144 | |
| JESD-609 Code | e6 | |
| Length | 18.5 mm | |
| Memory Density | 603979776 bit | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 144 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | ||
| Organization | 16MX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA144,12X18,40/32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | NO | |
| Sequential Burst Length | 2,4,8 | |
| Standby Current-Max | 0.215 A | |
| Supply Current-Max | 0.409 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN BISMUTH | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 11 mm |