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Part Details for UPD70F3825GB-GAH-AX by Renesas Electronics Corporation
Overview of UPD70F3825GB-GAH-AX by Renesas Electronics Corporation
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for UPD70F3825GB-GAH-AX
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
UPD70F3825GB-GAH-AX-ND
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DigiKey | IC MCU 32BIT 256KB FLASH 64LQFP Min Qty: 320 Lead time: 24 Weeks Container: Tray | Limited Supply - Call |
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$8.0936 | Buy Now |
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DISTI #
UPD70F3825GB-GAH-A
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Avnet Americas | MCU 32-bit V850ES RISC 256KB Flash 3.3V 64-Pin LQFP - Trays (Alt: UPD70F3825GB-GAH-A) RoHS: Compliant Min Qty: 320 Package Multiple: 160 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$6.5659 / $7.4965 | Buy Now |
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DISTI #
968-PD70F3825GBGAHAX
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Mouser Electronics | 32-bit Microcontrollers - MCU 32BIT MICROCONTROLLER RoHS: Compliant | 956 |
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$6.9400 / $10.9600 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 320 Package Multiple: 160 Container: Tray | 0Tray |
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$6.4700 | Buy Now |
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DISTI #
UPD70F3825GB-GAH-A
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Avnet Americas | MCU 32-bit V850ES RISC 256KB Flash 3.3V 64-Pin LQFP - Trays (Alt: UPD70F3825GB-GAH-A) RoHS: Compliant Min Qty: 320 Package Multiple: 160 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$6.5659 / $7.4965 | Buy Now |
|
DISTI #
UPD70F3825GB-GAH-A
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Avnet Americas | MCU 32-bit V850ES RISC 256KB Flash 3.3V 64-Pin LQFP - Trays (Alt: UPD70F3825GB-GAH-A) RoHS: Compliant Min Qty: 320 Package Multiple: 160 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$6.5659 / $7.4965 | Buy Now |
|
DISTI #
UPD70F3825GB-GAH-AX
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Avnet Silica | MCU 32-bit V850ES RISC 256KB Flash 3.3V 64-Pin LQFP (Alt: UPD70F3825GB-GAH-AX) RoHS: Compliant Min Qty: 160 Package Multiple: 160 Lead time: 3 Weeks, 5 Days | Silica - 0 |
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Buy Now | |
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DISTI #
2101536
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Farnell | MCU, 32BIT, V850ES, 48MHZ, LQFP-64 RoHS: Compliant Min Qty: 1 Lead time: 17 Weeks, 1 Days Container: Each | 0 |
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$8.1397 / $9.8875 | Buy Now |
Part Details for UPD70F3825GB-GAH-AX
UPD70F3825GB-GAH-AX CAD Models
UPD70F3825GB-GAH-AX Part Data Attributes
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UPD70F3825GB-GAH-AX
Renesas Electronics Corporation
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Datasheet
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UPD70F3825GB-GAH-AX
Renesas Electronics Corporation
32-bit Microcontrollers, LQFP, /
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | LQFP | |
| Package Description | LFQFP, QFP64,.47SQ,20 | |
| Pin Count | 64 | |
| Manufacturer Package Code | PLQP0064KF | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 24 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | V850 | |
| Clock Frequency-Max | 6 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G64 | |
| JESD-609 Code | e4 | |
| Length | 10 mm | |
| Number of I/O Lines | 45 | |
| Number of Terminals | 64 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP64,.47SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 24576 | |
| ROM (words) | 262144 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 48 MHz | |
| Supply Current-Max | 60 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.85 V | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |