-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
16-bit Low-power Microcontrollers for Inverter and Motor Control Applications (Non Promotion), LSSOP, /
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
UPD78F1201MC-CAB-AX-ND
|
DigiKey | IC MCU 16BIT 16KB FLASH 30SSOP Lead time: 30 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | |
DISTI #
UPD78F1201MC-CAB-AX
|
Avnet Silica | MCU 16-Bit 78K0R/Ix3 78K0R CISC 16KB Flash 3.3V/5V 30-Pin LSSOP (Alt: UPD78F1201MC-CAB-AX) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 28 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
UPD78F1201MC-CAB-AX
Renesas Electronics Corporation
Buy Now
Datasheet
|
Compare Parts:
UPD78F1201MC-CAB-AX
Renesas Electronics Corporation
16-bit Low-power Microcontrollers for Inverter and Motor Control Applications (Non Promotion), LSSOP, /
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | LSSOP | |
Package Description | LSSOP, SSOP30,.3 | |
Pin Count | 30 | |
Manufacturer Package Code | PLSP0030JB | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Renesas Electronics | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 16 | |
CPU Family | UPD78K0R | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | R-PDSO-G30 | |
JESD-609 Code | e4 | |
Length | 9.7 mm | |
Number of I/O Lines | 23 | |
Number of Terminals | 30 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LSSOP | |
Package Equivalence Code | SSOP30,.3 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
Qualification Status | Not Qualified | |
RAM (bytes) | 1024 | |
ROM (words) | 16384 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.4 mm | |
Speed | 40 MHz | |
Supply Current-Max | 8.4 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4 V | |
Supply Voltage-Nom | 4 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |