Part Details for WED3C755E8M-350BC by White Electronic Designs Corp
Overview of WED3C755E8M-350BC by White Electronic Designs Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Renewable Energy
Part Details for WED3C755E8M-350BC
WED3C755E8M-350BC CAD Models
WED3C755E8M-350BC Part Data Attributes:
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WED3C755E8M-350BC
White Electronic Designs Corp
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Datasheet
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WED3C755E8M-350BC
White Electronic Designs Corp
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 66 MHz | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | R-CBGA-B255 | |
| Low Power Mode | YES | |
| Number of Terminals | 255 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA255,16X16,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.85 mm | |
| Speed | 350 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.9 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for WED3C755E8M-350BC
This table gives cross-reference parts and alternative options found for WED3C755E8M-350BC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WED3C755E8M-350BC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TS(X)PC603PVGU/T6LE | 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 | e2v technologies | WED3C755E8M-350BC vs TS(X)PC603PVGU/T6LE |
| WEDMC64603RV200CM | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 | Microsemi Corporation | WED3C755E8M-350BC vs WEDMC64603RV200CM |
| TS(X)PC603RVGU/T6L(C) | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 | Thales Group | WED3C755E8M-350BC vs TS(X)PC603RVGU/T6L(C) |
| TS(X)PC603EVGB/T5MN | RISC Microprocessor, 32-Bit, 133MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | WED3C755E8M-350BC vs TS(X)PC603EVGB/T5MN |
| TSPC603EMGU2ML | RISC Microprocessor, 32-Bit, 80MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | WED3C755E8M-350BC vs TSPC603EMGU2ML |
| TSPC740AVGU/T12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | WED3C755E8M-350BC vs TSPC740AVGU/T12LH |
| TS(X)PC603EVGB/T4ML | 32-BIT, 120MHz, RISC PROCESSOR, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | WED3C755E8M-350BC vs TS(X)PC603EVGB/T4ML |
| IBM25EMPPC603E2BB200K | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, 3 MM HEIGHT, CERAMIC, BGA-255 | IBM | WED3C755E8M-350BC vs IBM25EMPPC603E2BB200K |
| MPC603RZT233TX | 32-BIT, 233MHz, RISC PROCESSOR, PBGA255, 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 | Motorola Mobility LLC | WED3C755E8M-350BC vs MPC603RZT233TX |
| TS(X)PC603RMGS8L(C) | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, 3.84 MM HEIGHT, CICGA-255 | e2v technologies | WED3C755E8M-350BC vs TS(X)PC603RMGS8L(C) |