There are no models available for this part yet.
Overview of XC226456F66LACKXUMA1 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for XC226456F66LACKXUMA1 by Infineon Technologies AG
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
XC226456F66LACKXUMA1TR-ND
|
DigiKey | IC MCU 16/32B 448KB FLSH 100LQFP Lead time: 12 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
|
Buy Now | ||
|
DISTI #
XC226456F66LACKXUM
|
Avnet Americas | MCU 16-Bit/32-Bit XC2000 C166 CISC/DSP/RISC 448KB Flash 3.3V/5V 100-Pin LQFP T/R - Tape and Reel (Alt: XC226456F66LACKXUM) RoHS: Not Compliant Min Qty: 1400 Package Multiple: 1 Container: Reel | 0 |
|
RFQ |
CAD Models for XC226456F66LACKXUMA1 by Infineon Technologies AG
Part Data Attributes for XC226456F66LACKXUMA1 by Infineon Technologies AG
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Not Recommended
|
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
|
Package Description
|
HLFQFP,
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.A.2
|
|
HTS Code
|
8542.31.00.01
|
|
Has ADC
|
YES
|
|
Address Bus Width
|
24
|
|
Bit Size
|
32
|
|
Clock Frequency-Max
|
40 MHz
|
|
DAC Channels
|
NO
|
|
DMA Channels
|
NO
|
|
External Data Bus Width
|
16
|
|
JESD-30 Code
|
S-PQFP-G100
|
|
Length
|
14 mm
|
|
Number of I/O Lines
|
73
|
|
Number of Terminals
|
100
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
PWM Channels
|
YES
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
HLFQFP
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
ROM Programmability
|
FLASH
|
|
Seated Height-Max
|
1.6 mm
|
|
Speed
|
66 MHz
|
|
Supply Voltage-Max
|
1.6 V
|
|
Supply Voltage-Min
|
1.4 V
|
|
Supply Voltage-Nom
|
1.5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
AUTOMOTIVE
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.5 mm
|
|
Terminal Position
|
QUAD
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
14 mm
|
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER
|
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