Part Details for XCV812E-6FG900C by AMD Xilinx
Overview of XCV812E-6FG900C by AMD Xilinx
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Price & Stock for XCV812E-6FG900C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | Field-Programmable Gate Array, 21168 Cell, 900 Pin, Plastic, BGA | 55 |
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$450.0000 / $562.5000 | Buy Now |
Part Details for XCV812E-6FG900C
XCV812E-6FG900C CAD Models
XCV812E-6FG900C Part Data Attributes
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XCV812E-6FG900C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCV812E-6FG900C
AMD Xilinx
Field Programmable Gate Array, 4704 CLBs, 254016 Gates, 357MHz, 21168-Cell, CMOS, PBGA900, PLASTIC, FBGA-900
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, FBGA-900 | |
| Pin Count | 900 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 357 MHz | |
| Combinatorial Delay of a CLB-Max | 0.47 ns | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e0 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 4704 | |
| Number of Equivalent Gates | 254016 | |
| Number of Inputs | 556 | |
| Number of Logic Cells | 21168 | |
| Number of Outputs | 556 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4704 CLBS, 254016 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 31 mm |
Alternate Parts for XCV812E-6FG900C
This table gives cross-reference parts and alternative options found for XCV812E-6FG900C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCV812E-6FG900C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XCV812E-6FGG900I | Field Programmable Gate Array, 4704 CLBs, 254016 Gates, 357MHz, CMOS, PBGA900, PLASTIC, FBGA-900 | AMD Xilinx | XCV812E-6FG900C vs XCV812E-6FGG900I |
| XCV812E-6FG900I | Field Programmable Gate Array, 4704 CLBs, 254016 Gates, 357MHz, 21168-Cell, CMOS, PBGA900, PLASTIC, FBGA-900 | AMD Xilinx | XCV812E-6FG900C vs XCV812E-6FG900I |
| XCV812E-6FGG900C | Field Programmable Gate Array, 4704 CLBs, 254016 Gates, 357MHz, CMOS, PBGA900, PLASTIC, FBGA-900 | AMD Xilinx | XCV812E-6FG900C vs XCV812E-6FGG900C |