Part Details for XEF232-1024-FB374-C40 by XMOS Ltd
Overview of XEF232-1024-FB374-C40 by XMOS Ltd
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
71024S12TYG | Renesas Electronics Corporation | 5.0V 128K x 8 Asynchronous Static RAM with Corner Power & Ground Pinout |
Price & Stock for XEF232-1024-FB374-C40
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
68Y1441
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Newark | 32 Bit Microcontroller, 32 Core, Ethernet, Xcore, 4 Mb, 1 Mb, 374, Fbga Rohs Compliant: Yes |Xmos XEF232-1024-FB374-C40 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Part Details for XEF232-1024-FB374-C40
XEF232-1024-FB374-C40 CAD Models
XEF232-1024-FB374-C40 Part Data Attributes
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XEF232-1024-FB374-C40
XMOS Ltd
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Datasheet
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XEF232-1024-FB374-C40
XMOS Ltd
RISC Microcontroller, 32-Bit, FLASH, XEF232 CPU, CMOS, PBGA374, FBGA-374
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Rohs Code | Yes | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | XMOS LTD | |
Package Description | FBGA-374 | |
Reach Compliance Code | compliant | |
Has ADC | NO | |
Additional Feature | Speed Grade 2000 MIPS | |
Address Bus Width | ||
Bit Size | 32 | |
Boundary Scan | YES | |
CPU Family | XEF232 | |
Clock Frequency-Max | 24 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | NO | |
JESD-30 Code | S-PBGA-B374 | |
Length | 18 mm | |
Low Power Mode | YES | |
Number of I/O Lines | 176 | |
Number of Serial I/Os | 4 | |
Number of Terminals | 374 | |
Number of Timers | 40 | |
On Chip Data RAM Width | 8 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA374,21X21,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
RAM (bytes) | 1048576 | |
ROM (words) | 4194304 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.36 mm | |
Supply Current-Max | 1400 mA | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 18 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |