Parametric results for: programming+msp3410+softw... under Other Consumer ICs
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MICRF112YMM-TR
Microchip Technology Inc
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$0.5549 | Yes | Active | TSSOP | CONSUMER CIRCUIT | 1 | 3.6 V | 1.8 V | AUTOMOTIVE | S-PDSO-G10 | Not Qualified | e4 | 2 | 125 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | TSSOP, TSSOP10,.19,20 | 10 | MSOP-10 | Compliant | EAR99 | 8542.39.00.01 | |||||||||
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BH7673G-TR
ROHM Semiconductor
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$0.5549 | Yes | Active | LSSOP | CONSUMER CIRCUIT | 1 | 5.5 V | 4.5 V | INDUSTRIAL | R-PDSO-G5 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 5 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 950 µm | DUAL | 1.6 mm | 2.9 mm | 1.25 mm | LSSOP, | Compliant | 8542.39.00.01 | |||||||||||||||||
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TPD12S520RMNR
Texas Instruments
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$0.5635 | Yes | Yes | Active | 12 | QCCN | CONSUMER CIRCUIT | 1 | 5.5 V | INDUSTRIAL | R-XQCC-N24 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | LCC24(UNSPEC) | RECTANGULAR | CHIP CARRIER | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1.5 mm | 4.5 mm | 800 µm | QCCN, LCC24(UNSPEC) | Compliant | EAR99 | 8542.39.00.60 | ||||||||||
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CMEJ-9745-37-P
Same Sky
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$0.5660 | Yes | Transferred | MICROPHONES | NOT SPECIFIED | NOT SPECIFIED | , | Compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||
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MICRF112YMM
Microchip Technology Inc
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$0.5684 | Yes | Active | TSSOP | CONSUMER CIRCUIT | 1 | 3.6 V | 1.8 V | AUTOMOTIVE | S-PDSO-G10 | Not Qualified | e4 | 2 | 125 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | 10 | MSOP-10 | Compliant | EAR99 | 8542.39.00.01 | ||||||||||
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PAM8904EGPR
Diodes Incorporated
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$0.5764 | Yes | Active | HVQCCN | CONSUMER CIRCUIT | 1 | 5.5 V | 1.5 V | S-XQCC-N12 | e3 | 85 °C | -40 °C | 260 | AEC-Q100 | 12 | UNSPECIFIED | LCC12,.08SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 400 µm | QUAD | 2 mm | 2 mm | 800 µm | HVQCCN, LCC12,.08SQ,16 | Compliant | EAR99 | 8542.39.00.01 | 2019-06-13 | |||||||||||||
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NCS2632DTBR2G
onsemi
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$0.5802 | Yes | Yes | Active | TSSOP | CONSUMER CIRCUIT | 1 | 5.5 V | 2.2 V | INDUSTRIAL | R-PDSO-G14 | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.2 mm | TSSOP, | 14 | 948G | Compliant | 8542.39.00.01 | TSSOP-14 | ||||||||||
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TSU6721YFFR
Texas Instruments
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$0.5804 | Yes | Yes | Active | 2 | 510 MHz | VFBGA | CONSUMER CIRCUIT | 1 | 155 µA | 6.5 V | 3 V | INDUSTRIAL | S-PBGA-B25 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 25 | PLASTIC/EPOXY | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 400 µm | BOTTOM | 2.066 mm | 2.066 mm | 625 µm | VFBGA, | Compliant | EAR99 | 8542.39.00.60 | |||||||||
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TDA8037T/C1Y
NXP Semiconductors
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$0.5990 | Yes | Active | CONSUMER CIRCUIT | e4 | 3 | 260 | 30 | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | , | 28 | SOT136-1 | Compliant | 8542.39.00.01 | SOP | ||||||||||||||||||||||||||||||
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TPD12S520DBTR
Texas Instruments
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$0.6059 | Yes | Yes | Active | 12 | TSSOP | CONSUMER CIRCUIT | 1 | 5 µA | 5.5 V | INDUSTRIAL | R-PDSO-G38 | Not Qualified | e4 | 2 | 85 °C | -40 °C | 260 | 30 | 38 | PLASTIC/EPOXY | TSSOP38,.25,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | TSSOP, TSSOP38,.25,20 | 38 | Compliant | EAR99 | 8542.39.00.60 | TSSOP |