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CME8000-SSOP28
 C-MAX Time Solutions 		Check for Price Contact Manufacturer SSOP 5 V RECEIVER IC BICMOS 1 1.2 V INDUSTRIAL INFRARED; RF R-PDSO-G28 85 °C -40 °C 28 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 650 µm DUAL 5.3 mm 10.2 mm 2 mm C-MAX SSOP, unknown 8542.39.00.01
TRF1400DWR
 Texas Instruments 		Check for Price No No Obsolete SOP 5.5 V RECEIVER IC BICMOS 1 4.5 V INDUSTRIAL RF R-PDSO-G24 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 24 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 7.5 mm 15.365 mm 2.65 mm TEXAS INSTRUMENTS INC SOP, not_compliant 8542.39.00.01 SOIC 24
CME8000-DDT
 C-MAX Time Solutions 		Check for Price Contact Manufacturer DIE 5 V RECEIVER IC BICMOS 1 1.2 V INDUSTRIAL INFRARED; RF R-XUUC-N26 85 °C -40 °C 26 UNSPECIFIED RECTANGULAR UNCASED CHIP YES NO LEAD UPPER C-MAX DIE, unknown 8542.39.00.01
MAX11042EBC-T
 Maxim Integrated Products 		Check for Price No Obsolete BGA 3.6 V SUPPORT CIRCUIT BICMOS 1 1.6 V INDUSTRIAL I2C S-PBGA-B12 Not Qualified e0 85 °C -40 °C 12 PLASTIC/EPOXY BGA16,4X4,20 SQUARE GRID ARRAY YES TIN LEAD BALL 500 µm BOTTOM MAXIM INTEGRATED PRODUCTS INC PLASTIC, UCSP-12 not_compliant 8542.39.00.01 BGA 12
CME8000-TLSH
 C-MAX Time Solutions 		Check for Price Yes Contact Manufacturer LSSOP 5 V RECEIVER IC BICMOS SEATED HGT-CALCULATED 1 1.2 V INDUSTRIAL INFRARED; RF R-PDSO-G28 85 °C -40 °C 28 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 9.225 mm 1.45 mm C-MAX LSSOP, unknown 8542.39.00.01
UPC2807AW
 NEC Electronics Group 		Check for Price No No Obsolete DIE 5.5 V SUPPORT CIRCUIT BICMOS 1 4.5 V COMMERCIAL EXTENDED INFRARED X-XUUC-N13 Not Qualified e0 80 °C -25 °C 13 UNSPECIFIED UNSPECIFIED UNCASED CHIP YES TIN LEAD NO LEAD UPPER NEC ELECTRONICS CORP DIE, compliant 8542.39.00.01 WAFER 13
MAX11041EBC-T
 Maxim Integrated Products 		Check for Price No No Obsolete BGA 3.6 V SUPPORT CIRCUIT BICMOS 1 1.6 V INDUSTRIAL I2C S-PBGA-B12 Not Qualified e0 85 °C -40 °C 12 PLASTIC/EPOXY BGA16,4X4,20 SQUARE GRID ARRAY YES TIN LEAD BALL 500 µm BOTTOM MAXIM INTEGRATED PRODUCTS INC PLASTIC, UCSP-12 not_compliant 8542.39.00.01 BGA 12
UPC2807HW
 NEC Electronics Group 		Check for Price No No Obsolete DIE 5.5 V SUPPORT CIRCUIT BICMOS 1 4.5 V COMMERCIAL EXTENDED INFRARED X-XUUC-N13 Not Qualified e0 80 °C -25 °C 13 UNSPECIFIED UNSPECIFIED UNCASED CHIP YES TIN LEAD NO LEAD UPPER NEC ELECTRONICS CORP DIE, compliant 8542.39.00.01 WAFER 13
MAX11041EBC
 Maxim Integrated Products 		Check for Price No Obsolete FBGA 3.6 V SUPPORT CIRCUIT BICMOS 1 1.6 V INDUSTRIAL I2C S-PBGA-B16 Not Qualified e0 85 °C -40 °C 16 PLASTIC/EPOXY BGA16,4X4,20 SQUARE GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 500 µm BOTTOM MAXIM INTEGRATED PRODUCTS INC not_compliant 8542.39.00.01
UPC2807HAW
 NEC Electronics Group 		Check for Price No No Obsolete DIE 5.5 V SUPPORT CIRCUIT BICMOS 1 4.5 V COMMERCIAL EXTENDED INFRARED X-XUUC-N13 Not Qualified e0 80 °C -25 °C 13 UNSPECIFIED UNSPECIFIED UNCASED CHIP YES TIN LEAD NO LEAD UPPER NEC ELECTRONICS CORP DIE, compliant 8542.39.00.01 WAFER 13
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