Parametric results for: TSS521D under Other Interface ICs
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PCA9548ADB
Texas Instruments
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$0.6128 | Yes | Yes | Active | 2.5 V | INTERFACE CIRCUIT | CMOS | 8 | 8 | 5.5 V | 2.3 V | YES | INDUSTRIAL | R-PDSO-G24 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 8.2 mm | 2 mm | 5.3 mm | SSOP | SSOP, | 24 | Compliant | EAR99 | 8542.39.00.60 | ||||||
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4DIR1400HAXUMA1
Infineon Technologies AG
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$0.6193 | Yes | Obsolete | 3.3 V | DIGITAL ISOLATOR | 1 | 6.5 V | 2.7 V | YES | R-PDSO-G16 | 3 | 125 °C | -40 °C | AEC-Q100 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | GULL WING | 1.27 mm | DUAL | 10.3 mm | 2.65 mm | 7.5 mm | SOP, SOP16,.4 | Compliant | EAR99 | 8542.39.00 | |||||||||||||||
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PI6ULS5V9509UEX
Diodes Incorporated
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$0.6305 | Yes | Active | 1.9 V | INTERFACE CIRCUIT | 1 | 4.5 V | 1.1 V | YES | INDUSTRIAL | S-PDSO-G8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | TSSOP, TSSOP8,.19 | Compliant | EAR99 | 8542.39.00.01 | |||||||||||||||
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CDM10VD3XTSA1
Infineon Technologies AG
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$0.6410 | Yes | Active | INTERFACE CIRCUIT | 1 | 25 V | 11 V | YES | INDUSTRIAL | R-PDSO-G6 | e3 | 1 | 105 °C | -40 °C | 6 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 950 µm | DUAL | 2.9 mm | 1.45 mm | 1.6 mm | LSSOP, | Compliant | EAR99 | 8542.39.00.90 | |||||||||||||||
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TDA8035HN/C2/S1QL
NXP Semiconductors
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$0.6486 | Yes | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 5.5 V | 2.7 V | YES | S-PQCC-N32 | 1 | 85 °C | -25 °C | 260 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 5 mm | 1 mm | 5 mm | QFN | HVQCCN, LCC32,.2SQ,20 | 32 | Compliant | 8542.39.00.01 | SOT617-7 | |||||||||||||
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TCA9517DGKR
Texas Instruments
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$0.6631 | Yes | Yes | Active | 3.3 V | BUS BUFFERS | 1 | 5.5 V | 900 mV | YES | INDUSTRIAL | S-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | SOIC | TSSOP, TSSOP8,.19 | 8 | Compliant | EAR99 | 8542.39.00.60 | ||||||||
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TDA8035HN/C2/S1EL
NXP Semiconductors
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$0.6635 | Yes | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 5.5 V | 2.7 V | YES | S-PQCC-N32 | 1 | 85 °C | -25 °C | 260 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 5 mm | 1 mm | 5 mm | QFN | HVQCCN, LCC32,.2SQ,20 | 32 | Compliant | 8542.39.00.01 | SOT617-7 | |||||||||||||
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TDA8035HN/C2/S1J
NXP Semiconductors
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$0.6739 | Yes | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 5.5 V | 2.7 V | YES | S-PQCC-N32 | e4 | 1 | 85 °C | -25 °C | 260 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 5 mm | 1 mm | 5 mm | QFN | HVQCCN, LCC32,.2SQ,20 | 32 | Compliant | 8542.39.00.01 | SOT617-7 | |||||||||||
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PCA9511ADP,118
NXP Semiconductors
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$0.6779 | Yes | Active | 3.3 V | BUS BUFFERS | 1 | 6 mA | 5.5 V | 2.7 V | YES | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | TSSOP | TSSOP, TSSOP8,.19 | 8 | Compliant | 8542.39.00.01 | SOT505-1 | |||||||
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HDMI2C4-5F2
STMicroelectronics
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$0.6810 | Yes | Active | INTERFACE CIRCUIT | , | Compliant | EAR99 | 8541.10.00.50 |