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41 - 50 of 174,627 results
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BLM15PG100SN1D
Murata Manufacturing Co Ltd
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$0.0134 | Yes | Yes | Active | 1 A | 25 mΩ | 10 OHM Ω | SURFACE MOUNT | 100 MHz | 100 MHz | FERRITE CHIP | MONOLITHIC TYPE | 1 | e3 | 125 °C | -55 °C | 0402 | Chip Bead | 2 | TR, PAPER, 7 INCH | TIN | 500 µm | 1 mm | 500 µm | MURATA MANUFACTURING CO LTD | EIA STD PACKAGE SIZE 0402, 2 PIN | compliant | EAR99 | 8504.50.80.00 | Murata Electronics | ||
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CIM05J152NC
Samsung Electro-Mechanics
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$0.0134 | Yes | Yes | Obsolete | 250 mA | 1 Ω | 1500 OHM Ω | SURFACE MOUNT | 100 MHz | 100 MHz | FERRITE CHIP | 1 | e3 | 125 °C | -55 °C | 0402 | Chip Bead | 2 | TAPE AND REEL | Matte Tin (Sn) - with Nickel (Ni) barrier | 500 µm | 1 mm | 500 µm | SAMSUNG ELECTRO-MECHANICS | EIA STD PACKAGE SIZE 0402, 2 PIN | compliant | EAR99 | 8504.50.80.00 | ||||
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CIS10P260AC
Samsung Electro-Mechanics
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$0.0134 | Yes | Obsolete | 6 A | 7 mΩ | 26 OHM Ω | SURFACE MOUNT | 100 MHz | 100 MHz | FERRITE CHIP | 1 | e3 | 125 °C | -55 °C | 0603 | Chip Bead | 2 | TAPE AND REEL | Matte Tin (Sn) - with Nickel (Ni) barrier | 800 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | 0603 | compliant | EAR99 | 8504.50.80.00 | |||||
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CIS10P700AC
Samsung Electro-Mechanics
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$0.0134 | Yes | Obsolete | 4 A | 20 mΩ | 70 OHM Ω | SURFACE MOUNT | 100 MHz | 100 MHz | FERRITE CHIP | 1 | e3 | 125 °C | -55 °C | 0603 | Chip Bead | 2 | TAPE AND REEL | Matte Tin (Sn) - with Nickel (Ni) barrier | 800 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | 0603 | compliant | EAR99 | 8504.50.80.00 | |||||
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CIM10U241NC
Samsung Electro-Mechanics
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$0.0134 | Yes | Yes | Obsolete | 400 mA | 300 mΩ | 240 OHM Ω | SURFACE MOUNT | 100 MHz | 100 MHz | FERRITE CHIP | 1 | e3 | 125 °C | -55 °C | 0603 | Chip Bead | 2 | TAPE AND REEL | Matte Tin (Sn) - with Nickel (Ni) barrier | 800 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | 0603 | compliant | EAR99 | 8504.50.80.00 | ||||
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CIS10P300AC
Samsung Electro-Mechanics
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$0.0134 | Yes | Obsolete | 6 A | 10 mΩ | 30 OHM Ω | SURFACE MOUNT | 100 MHz | 100 MHz | FERRITE CHIP | 1 | e3 | 125 °C | -55 °C | 0603 | Chip Bead | 2 | TAPE AND REEL | Matte Tin (Sn) - with Nickel (Ni) barrier | 800 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | EIA STD PACKAGE SIZE 0603, 2 PIN | compliant | EAR99 | 8504.50.80.00 | |||||
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MMZ2012D301BT000
TDK Corporation
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$0.0135 | Yes | End Of Life | 400 mA | 500 mΩ | 300 OHM Ω | SURFACE MOUNT | FERRITE CHIP | 1 | 125 °C | -55 °C | 0805 | Chip Bead | 2 | TR, 7 INCH | 850 µm | 2 mm | 1.25 mm | TDK CORP | 0805 | compliant | EAR99 | 8504.50.80.00 | TDK | ||||||||
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MMZ1608B301CTAH0
TDK Corporation
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$0.0136 | Yes | Active | 500 mA | 250 mΩ | 300 OHM Ω | SURFACE MOUNT | FERRITE CHIP | 1 | 125 °C | -55 °C | 0603 | Chip Bead | 2 | TR, 7 INCH | 600 µm | 1.6 mm | 800 µm | TDK CORP | EIA STD PACKAGE SIZE 1608, SMD, 2 PIN | compliant | EAR99 | 8504.50.80.00 | TDK | ||||||||
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NCB-H0603R151TR200F
NIC Components Corp
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$0.0139 | Yes | Yes | Active | 2 A | 100 mΩ | 150 OHM Ω | SURFACE MOUNT | 100 MHz | 100 MHz | FERRITE CHIP | 1 | e3 | 125 °C | -40 °C | 0603 | Chip Bead | 2 | TR, EMBOSSED, PLASTIC, 7 INCH | Matte Tin (Sn) - with Nickel (Ni) barrier | 800 µm | 1.6 mm | 800 µm | NIC COMPONENTS CORP | compliant | EAR99 | 8504.50.80.00 | |||||
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BBPY00100505300Y00
YAGEO Corporation
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$0.0139 | Yes | Transferred | 1.7 A | 50 mΩ | 30 OHM Ω | SURFACE MOUNT | FERRITE CHIP | 2 | 125 °C | -55 °C | 2 | TR, PAPER, 7 INCH | 500 µm | 1 mm | 500 µm | YAGEO CORP | EIA STD PACKAGE SIZE 0402, 2 PIN | unknown |