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Manufacturer Part Number: 74lvc1g58gw Sorted By: Family
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74LVC1G58GW-Q100
 NXP Semiconductors 		Check for Price Transferred 3.3 V 1 YES TSSOP LVC/LCX/Z LOGIC CIRCUIT CMOS 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 125 °C -40 °C AEC-Q100 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS TSSOP, unknown 8542.39.00.01
74LVC1G58GW-Q100,125
 NXP Semiconductors 		Check for Price Active 3.3 V 1 YES TSSOP LVC/LCX/Z LOGIC CIRCUIT CMOS 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 125 °C -40 °C AEC-Q100 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS PLASTIC, SC-88, SOT-363, 6 PIN unknown 8542.39.00.01
74LVC1G58GW
 Nexperia 		Check for Price Yes Active 1.8 V 1 YES TSSOP LVC/LCX/Z LOGIC CIRCUIT CMOS 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA compliant 8542.39.00.01
74LVC1G58GW-Q100
 Nexperia 		Check for Price Yes Active 1.8 V 1 YES TSSOP LVC/LCX/Z LOGIC CIRCUIT CMOS 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 AEC-Q100 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA SC-88, 6 PIN compliant 8542.39.00.01
74LVC1G58GW
 NXP Semiconductors 		Check for Price Yes Yes Transferred 1.8 V 7.9 ns 1 YES TSSOP 50 pF YES LVC/LCX/Z LOGIC CIRCUIT CMOS 24 mA 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY TSSOP6,.08 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS PLASTIC, SOT-363, SC-88, 6 PIN compliant 8542.39.00.01 SOT-363 6 EAR99
74LVC1G58GW,125
 NXP Semiconductors 		Check for Price Yes Transferred 1.8 V 7.9 ns 1 YES TSSOP 50 pF YES LVC/LCX/Z LOGIC CIRCUIT CMOS 24 mA 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY TSSOP6,.08 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS PLASTIC, SOT-363, SC-88, 6 PIN compliant 8542.39.00.01 TSSOP 6 SOT363
74LVC1G58GW-Q100H
 Nexperia 		$0.2113 Yes Active 1.8 V 1 YES TSSOP LVC/LCX/Z LOGIC CIRCUIT CMOS 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 AEC-Q100 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR, 7 INCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA SC-88, 6 PIN compliant TSSOP 6 SOT363-2 Nexperia
74LVC1G58GW,125
 Nexperia 		$0.1520 Yes Active 1.8 V 1 YES TSSOP LVC/LCX/Z LOGIC CIRCUIT CMOS 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR, 7 INCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA SOT-363, 6 PIN compliant 8542.39.00.01 TSSOP 6 EAR99 SOT363-2 Nexperia
74LVC1G58GW
 Philips Semiconductors 		Check for Price No Transferred 3.3 V 7.9 ns YES TSSOP 50 pF YES CMOS 24 mA AUTOMOTIVE R-PDSO-G6 Not Qualified e0 125 °C -40 °C 6 PLASTIC/EPOXY TSSOP6,.08 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR Tin/Lead (Sn/Pb) GULL WING 635 µm DUAL PHILIPS SEMICONDUCTORS unknown 8542.39.00.01