Parametric results for: H5TC4G63CFR-PBA under DRAMs

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Sorted By: Clock Frequency-Max (fCLK)
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MTC16C2085S1UC56BA1
Micron Technology Inc
Check for Price Active 274.8779 Gbit 64 4GX64 1.1 V 2.8011 GHz DUAL BANK PAGE BURST DDR5 DRAM MODULE SELF REFRESH 1 1 4000000000 4.295 G SYNCHRONOUS YES CMOS R-XDMA-N288 95 °C 288 UNSPECIFIED DIMM RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD DUAL MICRON TECHNOLOGY INC UDIMM-288 compliant
CT16G4DFD8266
Micron Technology Inc
Check for Price Active 137.439 Gbit 64 2GX64 1.2 V 2.666 GHz DDR4 DRAM MODULE COMMON 1 1 2000000000 2.1475 G SYNCHRONOUS NO 48 mA 2.2 mA 1.26 V 1.14 V CMOS OTHER R-XDMA-N288 85 °C 288 UNSPECIFIED DIMM DIMM288,33 RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD 850 µm DUAL 31.25 mm 133.35 mm 3.9 mm MICRON TECHNOLOGY INC UDIMM unknown EAR99 8542.32.00.36 2020-05-06
MTC4C10163S1SC48BA1
Micron Technology Inc
$46.2972 End Of Life 68.7195 Gbit 64 1GX64 1.1 V 2.4038 GHz SINGLE BANK PAGE BURST DDR5 DRAM MODULE SELF REFRESH 1 1 1000000000 1.0737 G SYNCHRONOUS YES 65 mA 778 µA CMOS R-XDMA-N262 95 °C 262 UNSPECIFIED DIMM RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD DUAL MICRON TECHNOLOGY INC SODIMM-262 compliant Micron
MTC16C2085S1UC48BA1
Micron Technology Inc
$159.0951 End Of Life 274.8779 Gbit 64 4GX64 1.1 V 2.4038 GHz DUAL BANK PAGE BURST DDR5 DRAM MODULE SELF REFRESH 1 1 4000000000 4.295 G SYNCHRONOUS YES 86 mA 993 µA CMOS R-XDMA-N288 95 °C 288 UNSPECIFIED DIMM RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD DUAL MICRON TECHNOLOGY INC UDIMM-288 compliant Micron
MT60B1G16HC-48B:A
Micron Technology Inc
$11.1899 End Of Life 17.1799 Gbit 16 1GX16 1.1 V 2.4038 GHz 8192 MULTI BANK PAGE BURST DDR5 DRAM SELF REFRESH COMMON 1 1 1000000000 1.0737 G SYNCHRONOUS 3-STATE YES CMOS R-PBGA-B102 95 °C 102 PLASTIC/EPOXY VFBGA BGA102,9X17,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1 mm 14 mm 9 mm MICRON TECHNOLOGY INC compliant Micron
W66CQ2NQUAHJ
Winbond Electronics Corp
Check for Price Active 4.295 Gbit 32 128MX32 1.1 V 2.1367 GHz MULTI BANK PAGE BURST LPDDR4X DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY;TERM PITCH-MAX COMMON 16,32 1 1 128000000 134.2177 M SYNCHRONOUS YES 16,32 1.17 V 1.06 V CMOS R-PBGA-B200 105 °C -40 °C 200 PLASTIC/EPOXY VFBGA BGA200,12X22,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm WINBOND ELECTRONICS CORP , unknown EAR99 8542.32.00.36 2020-06-24
MT53E1536M32D4DT-046AIT:A
Micron Technology Inc
Check for Price Yes Obsolete 51.5396 Gbit 32 1536MX32 1.8 V 2.1367 GHz MULTI BANK PAGE BURST LPDDR4 DRAM SELF REFRESH; IT ALSO REQUIRES 1.8V NOM COMMON 16,32 1 1 1536000000 1.6106 G SYNCHRONOUS YES 16,32 1.95 V 1.7 V CMOS R-PBGA-B200 95 °C -40 °C AEC-Q100 200 PLASTIC/EPOXY VFBGA BGA200,12X22,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 950 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC VFBGA-200 compliant
W66CP2NQUAHJ
Winbond Electronics Corp
Check for Price Active 4.295 Gbit 32 128MX32 1.1 V 2.1367 GHz MULTI BANK PAGE BURST LPDDR4 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; TERM PITCH-MAX COMMON 16,32 1 1 128000000 134.2177 M SYNCHRONOUS YES 16,32 1.17 V 1.06 V CMOS R-PBGA-B200 105 °C -40 °C 200 PLASTIC/EPOXY VFBGA BGA200,12X22,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm WINBOND ELECTRONICS CORP , unknown EAR99 8542.32.00.36 2020-06-23
W66BP6NBUAHJ
Winbond Electronics Corp
Check for Price Active 2.1475 Gbit 16 128MX16 1.1 V 2.1367 GHz MULTI BANK PAGE BURST LPDDR4 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; TERM PITCH-MAX COMMON 16,32 1 1 128000000 134.2177 M SYNCHRONOUS YES 16,32 1.17 V 1.06 V CMOS R-PBGA-B200 105 °C -40 °C 200 PLASTIC/EPOXY VFBGA BGA200,12X22,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm WINBOND ELECTRONICS CORP , unknown EAR99 8542.32.00.36 2020-06-23 Winbond
MT53D512M16D1DS-046AIT:D
Micron Technology Inc
Check for Price Active 8.5899 Gbit 16 512MX16 1.1 V 2.1367 GHz MULTI BANK PAGE BURST LPDDR4 DRAM SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX COMMON 16,32 1 1 512000000 536.8709 M SYNCHRONOUS YES 16,32 1.17 V 1.06 V CMOS INDUSTRIAL R-PBGA-B200 95 °C -40 °C AEC-Q100 200 PLASTIC/EPOXY VFBGA BGA200,12X22,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 800 µm 14.5 mm 10 mm MICRON TECHNOLOGY INC compliant EAR99 8542.32.00.36 2020-05-19