Parametric results for: AT24C02C-SSHM-T under EEPROMs

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NM24C17FLM8
Fairchild Semiconductor Corporation
Check for Price No No Obsolete 16.384 kbit 1 16KX1 3.3 V 400 kHz EEPROM 16 BYTE PAGE WRITE MODE; DATA RETENTION > 40 YEARS 40 1000000 Write/Erase Cycles 1010MMMR 1 16000 16.384 k SYNCHRONOUS SERIAL I2C 10 µA 1 µA 5.5 V 2.7 V CMOS COMMERCIAL 15 ms HARDWARE R-PDSO-G8 Not Qualified e0 70 °C 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm FAIRCHILD SEMICONDUCTOR CORP SOIC SOP, SOP8,.25 8 unknown EAR99 8542.32.00.51
EPC1064VPC8
Rochester Electronics LLC
Check for Price No No Active 65.536 kbit 1 64KX1 3.3 V 6 MHz CONFIGURATION MEMORY 4 WIRE INTERFACE TO FLEX 8000 DEVICES 1 64000 65.536 k SYNCHRONOUS SERIAL 3.6 V 3 V MOS COMMERCIAL R-PDIP-T8 COMMERCIAL e0 1 70 °C NOT SPECIFIED NOT SPECIFIED 8 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.318 mm 9.398 mm 7.62 mm ROCHESTER ELECTRONICS LLC DIP PLASTIC, DIP-8 8 unknown
M24164-WBN6
STMicroelectronics
Check for Price No No Obsolete 16.384 kbit 1 16KX1 5 V 400 kHz EEPROM 40 1000000 Write/Erase Cycles 1DDDMMMR 1 16000 16.384 k SYNCHRONOUS OPEN-DRAIN SERIAL I2C 1 µA 1 µA 5.5 V 2.5 V CMOS INDUSTRIAL 10 ms HARDWARE R-PDIP-T8 Not Qualified e0 85 °C -40 °C 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.9 mm 9.55 mm 7.62 mm STMICROELECTRONICS DIP DIP, DIP8,.3 8 not_compliant EAR99 8542.32.00.51
MX25L4005AM2I-12G
Macronix International Co Ltd
Check for Price Yes Obsolete 4.1943 Mbit 1 4MX1 3.3 V 85 MHz EEPROM 10 100000 Write/Erase Cycles 1 4000000 4.1943 M SYNCHRONOUS SERIAL 3-WIRE 10 µA 12 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.3 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 2.16 mm 5.28 mm 5.23 mm MACRONIX INTERNATIONAL CO LTD SOIC SOP, SOP8,.3 8 unknown 3A991.B.1.B.1 8542.32.00.51
XC1718LVO8C
AMD Xilinx
Check for Price No Obsolete 18.144 kbit 1 18144X1 5 V 2.5 MHz CONFIGURATION MEMORY COMMON 1 18144 18.144 k SYNCHRONOUS 3-STATE SERIAL 500 µA 5 µA 5.25 V 4.75 V CMOS COMMERCIAL R-PDSO-G8 Not Qualified e0 3 70 °C 225 30 8 PLASTIC/EPOXY TSOP2 TSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 1.27 mm DUAL 1.1938 mm 4.9276 mm 3.937 mm XILINX INC TSOP PLASTIC, TSOP-8 8 not_compliant EAR99 8542.32.00.51
RM24C64C-LSNI-T
Adesto Technologies Corporation
Check for Price Yes Transferred 65.536 kbit 1 64KX1 3.3 V 1 MHz EEPROM 1 64000 65.536 k SYNCHRONOUS SERIAL I2C 3.6 V 1.65 V CMOS INDUSTRIAL R-PDSO-G8 85 °C -40 °C 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 1.75 mm 4.925 mm 3.9 mm ADESTO TECHNOLOGIES CORP SOIC-8 compliant EAR99 8542.32.00.51 Adesto Technologies
XC1704LVQ44C
AMD Xilinx
Check for Price No No Obsolete 4.1943 Mbit 1 4MX1 3.3 V 15 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 4000000 4.1943 M SYNCHRONOUS 3-STATE SERIAL 50 µA 5 µA 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G44 Not Qualified e0 3 70 °C 240 30 44 PLASTIC/EPOXY TQFP TQFP44,.47SQ,32 SQUARE FLATPACK, THIN PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 800 µm QUAD 1.2 mm 10 mm 10 mm XILINX INC QFP TQFP, TQFP44,.47SQ,32 44 not_compliant 3A991.B.1.B.1 8542.32.00.51
NM24C17FLN
Fairchild Semiconductor Corporation
Check for Price No No Obsolete 16.384 kbit 1 16KX1 3.3 V 400 kHz EEPROM 16 BYTE PAGE WRITE MODE; DATA RETENTION > 40 YEARS 40 1000000 Write/Erase Cycles 1010MMMR 1 16000 16.384 k SYNCHRONOUS SERIAL I2C 10 µA 1 µA 5.5 V 2.7 V CMOS COMMERCIAL 15 ms HARDWARE R-PDIP-T8 Not Qualified e0 70 °C 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.08 mm 9.817 mm 7.62 mm FAIRCHILD SEMICONDUCTOR CORP DIP DIP, DIP8,.3 8 unknown EAR99 8542.32.00.51
AT17F080A-30JU
Microchip Technology Inc
$13.8350 Yes Yes Active 8.3886 Mbit 1 8MX1 3.3 V 10 MHz CONFIGURATION MEMORY 100000 Write/Erase Cycles 1 8000000 8.3886 M SYNCHRONOUS 3-STATE SERIAL 3.3 V 2-WIRE 3 mA 50 µA 3.63 V 2.97 V CMOS NOR TYPE 12 µs HARDWARE S-PQCC-J20 Not Qualified e3 85 °C -40 °C 20 PLASTIC/EPOXY QCCJ LDCC20,.4SQ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 4.572 mm 8.966 mm 8.966 mm MICROCHIP TECHNOLOGY INC , compliant EAR99 8542.32.00.51 Microchip
XC17512LSO20I
AMD Xilinx
Check for Price No No Obsolete 524.288 kbit 1 512KX1 3.3 V 15 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE SERIAL 50 µA 5 µA 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G20 Not Qualified e0 3 85 °C -40 °C 225 30 20 PLASTIC/EPOXY SOP SOP20,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn85Pb15) GULL WING 1.27 mm DUAL 2.6416 mm 12.827 mm 7.5184 mm XILINX INC SOIC PLASTIC, SOIC-20 20 not_compliant EAR99 8542.32.00.51