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31 - 40 of 21,844 results
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AM27C64-75DI
Rochester Electronics LLC
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Check for Price | Contact Manufacturer | 65.536 kbit | 8 | 8KX8 | 5 V | 70 ns | UVPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.25 V | 4.75 V | CMOS | INDUSTRIAL | R-GDIP-T28 | e0 | 85 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ROCHESTER ELECTRONICS LLC | DIP, | unknown | EAR99 | 8542.32.00.61 | |||||||||||||||
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WS57C256F-55L
Waferscale Integration Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 500 µA | 123 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CQCC-J32 | Not Qualified | e0 | 70 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | WAFERSCALE INTEGRATION INC | CERAMIC, LDCC-32 | unknown | ||||||||||||||
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AT27HC256R-55KI
Atmel Corporation
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 30 mA | 55 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CQCC-J32 | Not Qualified | e0 | 2 | 85 °C | -40 °C | 225 | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.24 mm | 14.1 mm | 11.55 mm | ATMEL CORP | WQCCJ, LDCC32,.5X.6 | unknown | EAR99 | 8542.32.00.61 | QFJ | 32 | |||
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CY7C265-18WMB
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 15 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | SYNCHRONOUS | 3-STATE | PARALLEL | 140 mA | 140 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | CYPRESS SEMICONDUCTOR CORP | 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 | not_compliant | 3A001.A.2.C | 8542.32.00.61 | DIP | 28 | ||||||||
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5962-8751501LA
Atmel Corporation
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Check for Price | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 45 ns | UVPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T24 | Not Qualified | e0 | 125 °C | -55 °C | 24 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 32 mm | 7.62 mm | ATMEL CORP | 0.300 INCH, WINDOWED, CERDIP-24 | unknown | 3A001.A.2.C | 8542.32.00.61 | DIP | 24 | |||||||||||
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5962-8606312QYA
Cypress Semiconductor
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 25 mA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | MIL-PRF-38535 Class Q | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | CYPRESS SEMICONDUCTOR CORP | CERAMIC, LCC-32 | not_compliant | 3A001.A.2.C | 8542.32.00.61 | QFJ | 32 | ||||||||
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HN27C4096ACC-10
Renesas Electronics Corporation
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Check for Price | Obsolete | 4.1943 Mbit | 16 | 256KX16 | 5 V | 100 ns | UVPROM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQCC-J44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | WQCCJ | SQUARE | CHIP CARRIER, WINDOW | YES | J BEND | 1.27 mm | QUAD | 4.8 mm | 16.51 mm | 16.51 mm | RENESAS TECHNOLOGY CORP | WQCCJ, | unknown | EAR99 | 8542.32.00.61 | LCC | 44 | |||||||||||||||
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NM27LC256QE250
Texas Instruments
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 10 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-GDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | NATIONAL SEMICONDUCTOR CORP | WDIP, DIP28,.6 | unknown | EAR99 | 8542.32.00.61 | DIP | 28 | ||||||||
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UPD27HC65DX-25
NEC Electronics Group
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Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 25 ns | UVPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 100 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | R-GDIP-T24 | Not Qualified | e0 | 70 °C | 24 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | NEC ELECTRONICS CORP | WDIP, | compliant | EAR99 | 8542.32.00.61 | DIP | 24 | ||||||||||||
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AM27C010-45DCB
Spansion
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Check for Price | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 45 ns | UVPROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CDIP-T32 | Not Qualified | 70 °C | 32 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 42.1 mm | 15.24 mm | SPANSION INC | DIP, | unknown | EAR99 | 8542.32.00.61 | DIP | 32 |