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AM27C64-55DI
Spansion
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CDIP-T28 | Not Qualified | 1 | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.147 mm | 15.24 mm | SPANSION INC | DIP | DIP, DIP28,.6 | 28 | unknown | EAR99 | 8542.32.00.61 | |||||||||
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MBM27128-25Z
FUJITSU Semiconductor Limited
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Check for Price | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 250 ns | UVPROM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 5.5 V | 4.5 V | NMOS | COMMERCIAL | R-GDIP-T28 | Not Qualified | 70 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.84 mm | 37.275 mm | 15.24 mm | FUJITSU SEMICONDUCTOR AMERICA INC | WDIP, | unknown | EAR99 | 8542.32.00.61 | ||||||||||||||||||
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AM27C400-100LIB
AMD
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Check for Price | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 100 ns | UVPROM | 16 | COMMON | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 40 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-CQCC-N44 | Not Qualified | e0 | 85 °C | -40 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC44,.65SQ | SQUARE | CHIP CARRIER, WINDOW | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 16.51 mm | 16.51 mm | ADVANCED MICRO DEVICES INC | LCC | WQCCN, LCC44,.65SQ | 44 | unknown | EAR99 | 8542.32.00.61 | ||||||||
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AS27C256-55ECAM
Micross Components
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Check for Price | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | MICROSS COMPONENTS | QFJ | 0.450 X 0.550 INCH, CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | ||||||||||
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DPV27C101-250B
Twilight Technology Inc
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Check for Price | No | No | Active | 1.0486 Mbit | 8 | 128KX8 | 5 V | 250 ns | UVPROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T32 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.842 mm | 41.91 mm | 15.24 mm | TWILIGHT TECHNOLOGY INC | DIP | WDIP, | 32 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||||
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AM2764-30DIB
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 300 ns | OTP ROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 21 V | 70 µA | MOS | INDUSTRIAL | R-XDIP-T28 | e0 | 85 °C | -40 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP, DIP28,.6 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||
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AT27HC642-90DC
Atmel Corporation
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 35 mA | 83 µA | CMOS | COMMERCIAL | R-XDIP-T24 | Not Qualified | e0 | 70 °C | 24 | CERAMIC | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ATMEL CORP | DIP, DIP24,.3 | unknown | EAR99 | 8542.32.00.61 | |||||||||||||||||
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AT27LV1024-30KC
Atmel Corporation
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 16 | 64KX16 | 5 V | 300 ns | UVPROM | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQCC-J44 | Not Qualified | e0 | 2 | 70 °C | 225 | 44 | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.57 mm | 16.65 mm | 16.65 mm | ATMEL CORP | LCC | WQCCJ, LDCC44,.7SQ | 44 | unknown | EAR99 | 8542.32.00.61 | |||||||
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AM27C4096-255LEB
AMD
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Check for Price | No | Obsolete | 4.1943 Mbit | 16 | 256KX16 | 5 V | 250 ns | UVPROM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 150 µA | 60 µA | 5.25 V | 4.75 V | CMOS | MILITARY | S-CQCC-N44 | Not Qualified | e0 | 125 °C | -55 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC44,.65SQ | SQUARE | CHIP CARRIER, WINDOW | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 16.51 mm | 16.51 mm | ADVANCED MICRO DEVICES INC | LCC | WQCCN, LCC44,.65SQ | 44 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||||
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TC5716200D-200
Toshiba America Electronic Components
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Check for Price | No | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 5 V | 200 ns | UVPROM | 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 60 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDIP-T42 | Not Qualified | e0 | 70 °C | 42 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 6.05 mm | 54.61 mm | 15.24 mm | TOSHIBA CORP | DIP | WDIP, | 42 | unknown | EAR99 | 8542.32.00.61 |