Parametric results for: 鄢陵spa哪里好+小妹q:719893330⊙ under Flash Memories

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Manufacturer: Spansion Sorted By: Number of Words Code
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S34ML08G101TFV003
Spansion
Check for Price Transferred 8.5899 Gbit 8 128K 1GX8 3.3 V FLASH YES NO NO 10 1 8K 1000000000 1.0737 G ASYNCHRONOUS 2K words PARALLEL 3.3 V YES 10 µA 35 µA 3.6 V 2.7 V CMOS INDUSTRIAL NO SLC NAND TYPE R-PDSO-G48 105 °C -40 °C 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, MO-142DD, TSOP1-48 unknown EAR99 8542.32.00.51
S29GL01GP11TFIV13
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC HTSSOP, TSSOP56,.8,20 unknown EAR99 8542.32.00.51 TSOP1 56
S29GL01GP12FAIR13
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 120 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC LBGA, unknown EAR99 8542.32.00.51 BGA 64
S29GL01GP11FFIR23
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3.3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 compliant EAR99 8542.32.00.51 BGA 64
S29GL01GP11TFIV20
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC HTSSOP, TSSOP56,.8,20 unknown EAR99 8542.32.00.51 TSOP1 56
S34ML08G101BHB003
Spansion
Check for Price Transferred 8.5899 Gbit 8 128K 1GX8 3.3 V FLASH YES NO NO 10 1 8K 1000000000 1.0737 G ASYNCHRONOUS 2K words PARALLEL 3.3 V YES 10 µA 35 µA 3.6 V 2.7 V CMOS INDUSTRIAL NO SLC NAND TYPE R-PBGA-B63 105 °C -40 °C AEC-Q100 63 PLASTIC/EPOXY VFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1 mm 11 mm 9 mm SPANSION INC 9 X 11 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63 unknown EAR99 8542.32.00.51
S29GL01GP12FACR22
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 120 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS OTHER NOR TYPE R-PBGA-B64 Not Qualified 85 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC LBGA, unknown EAR99 8542.32.00.51 BGA 64
S29GL01GP11FFIV13
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC LBGA, BGA64,8X8,40 unknown EAR99 8542.32.00.51 BGA 64
S29GL01GP12FAIV20
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3 V 120 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC LBGA, unknown EAR99 8542.32.00.51 BGA 64
S29GL01GP12TFI023
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 120 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 compliant EAR99 8542.32.00.51 TSOP1 56