Parametric results for: AM29LV640DU120RWHI under Flash Memories
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| Part Number |
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width |
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Organization |
Supply Voltage-Nom (Vsup)
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Power Supplies
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Access Time-Max
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Memory IC Type
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Additional Feature
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Boot Block
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Command User Interface
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Common Flash Interface
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Data Polling
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Number of Functions |
Number of Sectors/Size
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Number of Words Code | Number of Words |
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Parallel/Serial
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Programming Voltage
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Ready/Busy
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Standby Current-Max
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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Toggle Bit
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Type
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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AM29LV640DU120RWHI
AMD
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Check for Price | No | Transferred | 67.1089 Mbit | 16 | 32K | 4MX16 | 3.3 V | 3.3,3/5 V | 120 ns | FLASH | HARDWARE DATA PROTECTION/RESET PIN, 1 MILLION ERASE CYCLES PER SECTOR | YES | YES | YES | 1 | 128 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | ADVANCED MICRO DEVICES INC | BGA | 12 X 11 MM, 0.80 MM PITCH, FBGA-63 | 63 | unknown | EAR99 | 8542.32.00.51 | ||||||
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AM29LV640DU120RWHI
Spansion
|
Check for Price | No | No | Obsolete | 67.1089 Mbit | 16 | 32K | 4MX16 | 3.3 V | 3.3,3/5 V | 120 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 128 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | SPANSION INC | BGA | 12 X 11 MM, 0.80 MM PITCH, FBGA-63 | 63 | not_compliant | 3A991.B.1.A | 8542.32.00.51 | |||
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AM29LV640DU120RWHIN
AMD
|
Check for Price | No | Transferred | 67.1089 Mbit | 16 | 32K | 4MX16 | 3.3 V | 3.3,3/5 V | 120 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 128 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | ADVANCED MICRO DEVICES INC | BGA | 11 X 12 MM, 0.80 MM PITCH, FBGA-63 | 63 | unknown | EAR99 | 8542.32.00.51 | ||||||
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AM29LV640DU120RWHIN
Spansion
|
Check for Price | No | Obsolete | 67.1089 Mbit | 16 | 32K | 4MX16 | 3.3 V | 3.3,3/5 V | 120 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 128 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | SPANSION INC | BGA | 12 X 11 MM, 0.80 MM PITCH, FBGA-63 | 63 | compliant | EAR99 | 8542.32.00.51 |