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CFS1030A
Avago Technologies
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Check for Price | Active | 108 bit | 12 | 9X12 | MEMORY CIRCUIT | 1 | 9 | 9 words | SYNCHRONOUS | CMOS | Not Qualified | e0 | NOT SPECIFIED | NOT SPECIFIED | TIN LEAD | AVAGO TECHNOLOGIES INC | , | unknown | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||||||||||||||
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CFS1030A
Broadcom Limited
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Check for Price | Active | 108 bit | 12 | 9X12 | MEMORY CIRCUIT | 1 | 9 | 9 words | SYNCHRONOUS | CMOS | Not Qualified | e0 | NOT SPECIFIED | NOT SPECIFIED | TIN LEAD | BROADCOM LTD | , | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||||||||||||||
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CFS1030A
LSI Corporation
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Check for Price | No | No | Transferred | 108 bit | 12 | 9X12 | MEMORY CIRCUIT | 1 | 9 | 9 words | SYNCHRONOUS | CMOS | Not Qualified | e0 | TIN LEAD | LSI CORP | , | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||||||||||||||
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MB89R112A1-DIAP15-JN
FUJITSU Limited
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Check for Price | Active | 73.728 kbit | 8 | 9KX8 | FRAM-EMBEDDED | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | 10 | 1000000000000 Write/Erase Cycles | 1 | 9000 | 9.216 k | CMOS | X-XUUC-N | e4 | 85 °C | -20 °C | UNSPECIFIED | DIE | DIE OR CHIP | UNSPECIFIED | UNCASED CHIP | YES | GOLD | NO LEAD | UPPER | FUJITSU LTD | DIE, | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||||
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MB89R112A1-DIAP15-JN
FUJITSU Semiconductor Limited
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Check for Price | Active | 73.728 kbit | 8 | 9KX8 | FRAM-EMBEDDED | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | 10 | 1000000000000 Write/Erase Cycles | 1 | 9000 | 9.216 k | CMOS | X-XUUC-N | e4 | 85 °C | -20 °C | UNSPECIFIED | DIE | DIE OR CHIP | UNSPECIFIED | UNCASED CHIP | YES | GOLD | NO LEAD | UPPER | FUJITSU LTD | DIE, | unknown | EAR99 | 8542.32.00.71 | WAFER | |||||||||||||||||||||||
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MB89R112A1-DIAP15-JNP1
FUJITSU Limited
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Check for Price | Active | 73.728 kbit | 8 | 9KX8 | FRAM-EMBEDDED | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | 10 | 1000000000000 Write/Erase Cycles | 1 | 9000 | 9.216 k | CMOS | X-XUUC-N | e4 | 85 °C | -20 °C | UNSPECIFIED | DIE | DIE OR CHIP | UNSPECIFIED | UNCASED CHIP | YES | GOLD | NO LEAD | UPPER | FUJITSU LTD | DIE, | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||||
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MB89R112B2QN-G-AMERE1
FUJITSU Semiconductor Limited
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Check for Price | Yes | Active | 73.728 kbit | 8 | 9KX8 | 3.3 V | 2 MHz | FRAM-EMBEDDED | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | 10 | 1000000000000 Write/Erase Cycles | 1 | 9000 | 9.216 k | SERIAL | SPI | 3 V | 200 nA | 3.6 V | 3 V | CMOS | S-PQCC-N24 | 85 °C | -20 °C | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 750 µm | 4 mm | 4 mm | FUJITSU LTD | HVQCCN, | compliant | EAR99 | 8542.32.00.71 | QFN | 24 | ||||||||||
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MB89R112A2-DIAP15-JN
FUJITSU Semiconductor Limited
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Check for Price | Contact Manufacturer | 73.728 kbit | 8 | 9KX8 | FRAM-EMBEDDED | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | 10 | 1000000000000 Write/Erase Cycles | 1 | 9000 | 9.216 k | CMOS | X-XUUC-N | e4 | 85 °C | -20 °C | UNSPECIFIED | DIE | DIE OR CHIP | UNSPECIFIED | UNCASED CHIP | YES | GOLD | NO LEAD | UPPER | FUJITSU LTD | DIE, | unknown | EAR99 | 8542.32.00.71 | WAFER | |||||||||||||||||||||||
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MB89R112B1QN-G-AMEFE1
FUJITSU Semiconductor Limited
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Check for Price | Yes | Contact Manufacturer | 73.728 kbit | 8 | 9KX8 | 3.3 V | 2 MHz | FRAM-EMBEDDED | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | 10 | 1000000000000 Write/Erase Cycles | 1 | 9000 | 9.216 k | SERIAL | SPI | 48 µA | 3 V | 500 nA | 3.6 V | 3 V | CMOS | S-PQCC-N24 | 85 °C | -20 °C | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 750 µm | 4 mm | 4 mm | FUJITSU LTD | HVQCCN, | compliant | EAR99 | 8542.32.00.71 | QFN | 24 | |||||||||
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MB89R112B2QN-G-AMEFE1
FUJITSU Limited
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Check for Price | Yes | Contact Manufacturer | 73.728 kbit | 8 | 9KX8 | 3.3 V | 2 MHz | FRAM-EMBEDDED | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | 10 | 1000000000000 Write/Erase Cycles | 1 | 9000 | 9.216 k | SERIAL | SPI | 3 V | 200 nA | 3.6 V | 3 V | CMOS | S-PQCC-N24 | 85 °C | -20 °C | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 750 µm | 4 mm | 4 mm | FUJITSU LTD | HVQCCN, | compliant | EAR99 | 8542.32.00.71 |