Findchips: Parametric Search Results for AM49LV6408M

Parametric results for: AM49LV6408M under Other Memory ICs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		AM49LV6408MT10IT Spansion
		AM49LV6408MT11FT Spansion
		AM49LV6408MB15FT Spansion
		AM49LV6408MB10IT Spansion
		AM49LV6408MB11IT Spansion
		AM49LV6408MB11FT Spansion
		AM49LV6408MT15IT Spansion
		AM49LV6408MB15IT Spansion
		AM49LV6408MB10FT Spansion
		AM49LV6408MT11IT Spansion

			Most Relevant				Technical										Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, TOP BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, TOP BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, TOP BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, TOP BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

1 2 3 Next

Compare

AM49LV6408MT10IT

Spansion

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, TOP BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

AM49LV6408MT11FT

Spansion

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, TOP BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

AM49LV6408MB15FT

Spansion

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

AM49LV6408MB10IT

Spansion

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

AM49LV6408MB11IT

Spansion

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

AM49LV6408MB11FT

Spansion

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

AM49LV6408MT15IT

Spansion

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, TOP BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

AM49LV6408MB15IT

Spansion

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

AM49LV6408MB10FT

Spansion

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, BOTTOM BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

AM49LV6408MT11IT

Spansion

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANISED AS 512K X 16, TOP BOOT BLOCK

4000000

4.1943 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B69

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

SPANSION INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.71

1 2 3 Next