Parametric results for: s71al016m under Other Memory ICs

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Manufacturer Part Number: s71al016m Sorted By: Number of Words
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S71AL016M40BFW0B0
AMD
Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 3.3 V 90 ns MEMORY CIRCUIT FLASH+PSRAM 1 1000000 1.0486 M ASYNCHRONOUS 5 µA 60 µA 3.6 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified 85 °C -25 °C 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm ADVANCED MICRO DEVICES INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71AL016M40BFW0B3
AMD
Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 3.3 V 90 ns MEMORY CIRCUIT FLASH+PSRAM 1 1000000 1.0486 M ASYNCHRONOUS 5 µA 60 µA 3.6 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified 85 °C -25 °C 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm ADVANCED MICRO DEVICES INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71AL016M40BFW0B3
Spansion
Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 3 V MEMORY CIRCUIT PSRAM IS ORGANIZED AS 256K X 16 1 1000000 1.0486 M ASYNCHRONOUS 3.1 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified e1 3 85 °C -25 °C 260 40 56 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC BGA 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-56 56 unknown EAR99 8542.32.00.71
S71AL016M40BFW0F3
AMD
Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 3.3 V 90 ns MEMORY CIRCUIT FLASH+PSRAM 1 1000000 1.0486 M ASYNCHRONOUS 5 µA 60 µA 3.6 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified 85 °C -25 °C 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm ADVANCED MICRO DEVICES INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71AL016M40BAW0F0
AMD
Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 3.3 V 90 ns MEMORY CIRCUIT FLASH+PSRAM 1 1000000 1.0486 M ASYNCHRONOUS 5 µA 60 µA 3.6 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified 85 °C -25 °C 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm ADVANCED MICRO DEVICES INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71AL016M40BAW0B0
AMD
Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 3.3 V 90 ns MEMORY CIRCUIT FLASH+PSRAM 1 1000000 1.0486 M ASYNCHRONOUS 5 µA 60 µA 3.6 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified 85 °C -25 °C 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm ADVANCED MICRO DEVICES INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71AL016M40BAW0F3
AMD
Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 3.3 V 90 ns MEMORY CIRCUIT FLASH+PSRAM 1 1000000 1.0486 M ASYNCHRONOUS 5 µA 60 µA 3.6 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified 85 °C -25 °C 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm ADVANCED MICRO DEVICES INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71AL016M40BFW0F2
AMD
Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 3.3 V 90 ns MEMORY CIRCUIT FLASH+PSRAM 1 1000000 1.0486 M ASYNCHRONOUS 5 µA 60 µA 3.6 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified 85 °C -25 °C 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm ADVANCED MICRO DEVICES INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71AL016M40BAW0F0
Spansion
Check for Price No Obsolete 16.7772 Mbit 16 1MX16 3 V MEMORY CIRCUIT PSRAM IS ORGANIZED AS 256K X 16 1 1000000 1.0486 M ASYNCHRONOUS 3.1 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified e0 85 °C -25 °C 56 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC BGA TFBGA, 56 compliant EAR99 8542.32.00.71
S71AL016M40BAW0F2
Spansion
Check for Price No Obsolete 16.7772 Mbit 16 1MX16 3 V MEMORY CIRCUIT PSRAM IS ORGANIZED AS 256K X 16 1 1000000 1.0486 M ASYNCHRONOUS 3.1 V 2.7 V CMOS OTHER R-PBGA-B56 Not Qualified e0 85 °C -25 °C 56 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC BGA TFBGA, 56 compliant EAR99 8542.32.00.71