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Parametric results for: Secondary Storage Controllers

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WD2795AL-02
 Western Digital Corp 		Check for Price No Obsolete NO MOS COMMERCIAL R-XDIP-T40 Not Qualified e0 70 °C 40 CERAMIC DIP DIP40,.6 RECTANGULAR IN-LINE Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL WESTERN DIGITAL CORP unknown 8542.31.00.01
MC68HC99FN
 Freescale Semiconductor 		Check for Price No Obsolete YES CMOS COMMERCIAL S-PQCC-J52 Not Qualified e0 70 °C 52 PLASTIC/EPOXY QCCJ LDCC52,.8SQ SQUARE CHIP CARRIER Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD MOTOROLA SEMICONDUCTOR PRODUCTS unknown QCCJ, LDCC52,.8SQ
RC01DW24AC
 Runcore Innovation Technology Co Ltd 		Check for Price Yes Contact Manufacturer FLASH MODULE RUNCORE INNOVATION TECHNOLOGY CO LTD unknown 8542.32.00.51 DIE, EAR99
MTFDDAT256MAM-1J2
 Micron Technology Inc 		Check for Price Active CMOS FLASH 3.3 V MICRON TECHNOLOGY INC unknown 8542.32.00.51 , EAR99 MLC NAND TYPE
RC01FW24AC
 Runcore Innovation Technology Co Ltd 		Check for Price Yes Contact Manufacturer FLASH MODULE RUNCORE INNOVATION TECHNOLOGY CO LTD unknown 8542.32.00.51 DIE, EAR99
RC01HW2AAB
 Runcore Innovation Technology Co Ltd 		Check for Price Yes Contact Manufacturer FLASH MODULE RUNCORE INNOVATION TECHNOLOGY CO LTD unknown 8542.32.00.51 DIE, EAR99
MTFDDAT256MAY-1AH12AAHA
 Micron Technology Inc 		Check for Price Obsolete NO CMOS 2.199 Tbit FLASH MODULE 8 1 256000000000 274.8779 G ASYNCHRONOUS 256GX8 SERIAL 3.3 V 3.46 V 3.14 V 3.3 V COMMERCIAL R-XDMA-N52 70 °C 52 UNSPECIFIED DIMM RECTANGULAR MICROELECTRONIC ASSEMBLY NO LEAD DUAL 3.75 mm 29.85 mm 50.8 mm MICRON TECHNOLOGY INC compliant 8542.32.00.51 DIE, EAR99 MLC NAND TYPE
FDC1761-02
 SMSC 		Check for Price No Obsolete NO MOS COMMERCIAL R-XDIP-T40 Not Qualified e0 70 °C 235 40 CERAMIC DIP DIP40,.6 RECTANGULAR IN-LINE TIN LEAD THROUGH-HOLE 2.54 mm DUAL STANDARD MICROSYSTEMS CORP unknown 8542.31.00.01 DIP, DIP40,.6
MCBOE32GQAPR-MWA
 Samsung Semiconductor 		Check for Price Obsolete ATA 16 YES 3.3 V SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE CMOS 3.6 V 3 V COMMERCIAL EXTENDED X-PBGA-B Not Qualified 85 °C -25 °C PLASTIC/EPOXY BGA UNSPECIFIED GRID ARRAY BALL BOTTOM SAMSUNG SEMICONDUCTOR INC unknown 8542.31.00.01 BGA, BGA
MTFDDAK240MAV-1AE11AAHA
 Micron Technology Inc 		Check for Price Active NO CMOS 2.0616 Tbit FLASH MODULE 8 1 240000000000 257.698 G ASYNCHRONOUS 240GX8 3-STATE SERIAL 5 V 5.5 V 4.5 V 5 V COMMERCIAL R-XSMA-N22 70 °C 22 UNSPECIFIED SMA RECTANGULAR MICROELECTRONIC ASSEMBLY NO LEAD SINGLE 7 mm 69.85 mm 100.45 mm MICRON TECHNOLOGY INC compliant 8542.32.00.51 DIE, EAR99 MLC NAND TYPE
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