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41 - 50 of 13,230 results
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TMS320C6424ZWTQ6
Texas Instruments
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$41.5081 | Yes | Yes | Active | 32 | 20480 | 32 | 32 | 30 MHz | 5 | YES | 1.2 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | NO | YES | FIXED POINT | YES | MULTIPLE | YES | 64 | 8 | 8 | MROM | 1.26 V | 1.14 V | AUTOMOTIVE | S-PBGA-B361 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 30 | 361 | PLASTIC/EPOXY | LFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 16 mm | 16 mm | TEXAS INSTRUMENTS INC | BGA | 16 X 16 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-361 | 361 | compliant | 3A991.A.2 | 8542.31.00.01 | ||||
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ADSP-21060LCW-133
Analog Devices Inc
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Check for Price | No | Obsolete | 32 | 131072 | 48 | 32 | 33.3 MHz | YES | 3.3 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | YES | YES | FLOATING POINT | MULTIPLE | YES | 540 mA | 3.45 V | 3.15 V | INDUSTRIAL | S-CQFP-G240 | Not Qualified | e0 | 3 | 100 °C | -40 °C | 240 | CERAMIC, METAL-SEALED COFIRED | HFQFP | HQFP240,1.37SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | TIN LEAD SILVER | GULL WING | 500 µm | QUAD | 4.2 mm | 32 mm | 32 mm | ANALOG DEVICES INC | QFP | THERMALLY ENHANCED, METRIC, HEAT SINK, CERAMIC, QFP-240 | 240 | unknown | 3A991.A.2 | 8542.31.00.01 | ||||||||||||
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TMS32C6414DGLZW6E3
Texas Instruments
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Check for Price | No | No | Obsolete | 32 | 4096 | 64 | 32 | 75.18 MHz | YES | 1.4 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | ALSO REQUIRES 3.3VI/O SUPPLY | NO | YES | FIXED POINT | MULTIPLE | YES | 1.44 V | 1.36 V | S-PBGA-B532 | Not Qualified | e0 | 4 | 220 | 20 | 532 | PLASTIC/EPOXY | HFBGA | BGA532,26X26,32 | SQUARE | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | TIN LEAD | BALL | 800 µm | BOTTOM | 3.3 mm | 23 mm | 23 mm | TEXAS INSTRUMENTS INC | BGA | BGA-532 | 532 | not_compliant | 3A991.A.2 | 8542.31.00.01 | ||||||||||||
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ASDP-21060CW-133
Analog Devices Inc
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Check for Price | No | Active | 32 | 4194304 | 48 | 32 | 33.33 MHz | YES | 5 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | YES | YES | FLOATING POINT | MULTIPLE | YES | 5.25 V | 4.75 V | INDUSTRIAL | S-CQFP-G240 | Not Qualified | 100 °C | -40 °C | 240 | CERAMIC, METAL-SEALED COFIRED | HFQFP | HQFP240,1.37SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | GULL WING | 500 µm | QUAD | 4.2 mm | 32 mm | 32 mm | ANALOG DEVICES INC | QFP | CERAMIC, QFP-240 | 240 | compliant | 3A991.A.2 | 8542.31.00.01 | ||||||||||||||||
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WH21FXL1X-001X
White Microelectronics
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Check for Price | Obsolete | 32 | 32 | 25 MHz | YES | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | NO | YES | FIXED POINT | MULTIPLE | NO | R-XQMA-G296 | Not Qualified | 296 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | GULL WING | QUAD | WHITE MICROELECTRONICS | unknown | 8542.31.00.01 | |||||||||||||||||||||||||||||||||||
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TMS320C6416GLZ400
Texas Instruments
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Check for Price | Obsolete | 32 | 32 | 32 | 75.18 MHz | YES | 1.2 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | 0 TO 90 OPERATING CASE TEMPERATURE | NO | YES | FIXED POINT | MULTIPLE | YES | 1.24 V | 1.16 V | S-PBGA-B532 | Not Qualified | 532 | PLASTIC/EPOXY | HFBGA | BGA532,26X26,32 | SQUARE | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | BALL | 800 µm | BOTTOM | 3.3 mm | 23 mm | 23 mm | TEXAS INSTRUMENTS INC | BGA | HFBGA, BGA532,26X26,32 | 532 | unknown | 3A991.A.2 | 8542.31.00.01 | ||||||||||||||||||||
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XC8101M1375C
Motorola Mobility LLC
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Check for Price | Obsolete | 16 | 524288 | 64 | 32 | 68.75 MHz | YES | 1.6 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | NO | YES | FIXED POINT | MULTIPLE | YES | 1.7 V | 1.5 V | COMMERCIAL | S-PBGA-B332 | Not Qualified | 70 °C | 332 | PLASTIC/EPOXY | FBGA | BGA332,19X19,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2.6 mm | 17 mm | 17 mm | MOTOROLA INC | BGA | FBGA, BGA332,19X19,32 | 332 | unknown | 3A991.A.2 | 8542.31.00.01 | ||||||||||||||||||
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AD14160LKB-4
Rochester Electronics LLC
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Check for Price | No | No | Active | 48 | 32 | 40 MHz | YES | 5 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | YES | YES | FLOATING POINT | MULTIPLE | YES | 5.25 V | 4.75 V | OTHER | S-CBGA-B452 | COMMERCIAL | e0 | NOT SPECIFIED | 85 °C | NOT SPECIFIED | NOT SPECIFIED | 452 | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 5.08 mm | 46.995 mm | 46.995 mm | ROCHESTER ELECTRONICS INC | BGA | BGA, | 452 | unknown | ||||||||||||||||
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ADSP-21062LKSZ-160
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 48 | 32 | 40 MHz | YES | 3.3 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | YES | YES | FLOATING POINT | MULTIPLE | YES | 3.45 V | 3.15 V | OTHER | S-PQFP-G240 | COMMERCIAL | e3 | 3 | 85 °C | 260 | 40 | 240 | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 4.1 mm | 32 mm | 32 mm | ROCHESTER ELECTRONICS LLC | QFP | ROHS COMPLIANT, MS-029GA, MQFP-240 | 240 | unknown | ||||||||||||||||
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ADSP-21062KB-160
Rochester Electronics LLC
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Check for Price | No | No | Active | 48 | 32 | 40 MHz | YES | 5 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | YES | YES | FLOATING POINT | MULTIPLE | YES | 5.25 V | 4.75 V | OTHER | S-PBGA-B225 | COMMERCIAL | e0 | 3 | 85 °C | 225 | 30 | 225 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD SILVER | BALL | 1.27 mm | BOTTOM | 2.7 mm | 23 mm | 23 mm | ROCHESTER ELECTRONICS INC | BGA | BGA, | 225 | unknown |