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MB86834PFV
FUJITSU Limited
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Check for Price | No | Obsolete | 32 | 108 MHz | 32 | 28 | 108 MHz | YES | 3.3 V | MICROCONTROLLER, RISC | CMOS | NO | NO | NO | NO | 3.45 V | 3.15 V | COMMERCIAL | S-PQFP-G176 | Not Qualified | e0 | 70 °C | 176 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 3.85 mm | 24 mm | 24 mm | FUJITSU LTD | FQFP, | compliant | 3A991.A.2 | 8542.31.00.01 | ||||||||||||||||||||||||||||||
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KS0161Q
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 16 | 16.9344 MHz | 16 | 25 | 16.9344 MHz | YES | 5 V | MICROCONTROLLER | CMOS | NO | YES | NO | NO | 5.25 V | 4.75 V | COMMERCIAL | S-PQFP-G16 | Not Qualified | e0 | 70 °C | 16 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | TIN LEAD | GULL WING | 650 µm | QUAD | 4 mm | 28 mm | 28 mm | SAMSUNG SEMICONDUCTOR INC | QFP, | compliant | 8542.31.00.01 | QFP | 16 | ||||||||||||||||||||||||||||
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MPC5777MDKVA8R
NXP Semiconductors
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Check for Price | Active | 32 | 300 MHz | 8388608 | 413696 | 32 | 32 | 40 MHz | YES | 1.325 V | MICROCONTROLLER, RISC | CMOS | INCLUDES GTM104, ETHERNET SUPPORT, 74KB(ADDITIONAL RAM) | NO | YES | YES | 8 | NO | FLASH | 1.38 V | 1.19 V | AUTOMOTIVE | S-PBGA-B512 | 135 °C | -40 °C | ISO 26262 | 512 | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2.36 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | TEBGA-512 | unknown | 3A991.A.2 | 8542.31.00.01 | |||||||||||||||||||||||||||
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ATTINY13A-SFR
Atmel Corporation
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$0.9325 | Yes | Transferred | 8 | 20 MHz | 1024 | 64 | AVR RISC | 8 MHz | 4 | YES | 5 V | MICROCONTROLLER, RISC | CMOS | 10 | 0 | 20 | AVR | NO | AVR | NO | 1 | YES | 8 | NO | 0.06 | FLASH | 6 mA | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G8 | Not Qualified | e3 | 125 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | ATMEL CORP | SOP, SOP8,.3 | compliant | 8542.31.00.01 | SOIC | 8 | Microchip | |||||||||||||||||
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S9KEAZ64AMLK
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | 48 MHz | 65536 | 16384 | 24 MHz | YES | 3 V | MICROCONTROLLER, RISC | CMOS | NO | NO | YES | 8 | YES | FLASH | 5.5 V | 2.7 V | AUTOMOTIVE | S-PQFP-G80 | e3 | 3 | 125 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | MATTE TIN | GULL WING | QUAD | FREESCALE SEMICONDUCTOR INC | LQFP-80 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||||||||||||||||||
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UJA1079ATW/3V3/WD
NXP Semiconductors
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Check for Price | Yes | Active | 16 | 563 kHz | 563 kHz | YES | 14 V | MICROCONTROLLER | CMOS | NO | NO | NO | NO | 28 V | 4.5 V | AUTOMOTIVE | R-PDSO-G32 | Not Qualified | 3 | 125 °C | -40 °C | 260 | 32 | PLASTIC/EPOXY | HTSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | GULL WING | 650 µm | DUAL | 1.1 mm | 6.1 mm | 11 mm | NXP SEMICONDUCTORS | 11 X 6.10 MM, 0.65 MM PITCH, GREEN, PLASTIC, MO-153, SOT-549-1, HTSSOP-32 | compliant | 8542.39.00.01 | TSSOP | 32 | NXP | |||||||||||||||||||||||||||||
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TC267D40F200NBCLXUMA1
Infineon Technologies AG
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$23.2847 | Yes | Active | 32 | 200 MHz | 2621440 | 245760 | 200 MHz | YES | 1.3 V | MICROCONTROLLER | CMOS | A/D INPUT LINES 50; 7 ADC MODULES | NO | YES | YES | 8 | NO | FLASH | 1.43 V | 1.17 V | R-PBGA-B292 | e2 | 3 | NOT SPECIFIED | NOT SPECIFIED | 292 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 1.7 mm | 17 mm | 17 mm | INFINEON TECHNOLOGIES AG | LFBGA, | compliant | 3A991.A.2 | 8542.31.00.01 | Infineon | 2017-12-11 | |||||||||||||||||||||||||
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MPC565CZP40
Freescale Semiconductor
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Check for Price | No | No | Transferred | 32 | 40 MHz | 1048576 | 36864 | 32 | 24 | 84 MHz | YES | 2.6 V | MICROCONTROLLER, RISC | CMOS | ALSO REQUIRES 5V SUPPLY | NO | NO | NO | 8 | YES | FLASH | 120 mA | 2.7 V | 2.5 V | INDUSTRIAL | S-PBGA-B388 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 240 | 30 | 388 | PLASTIC/EPOXY | BGA | BGA388,26X26,40 | SQUARE | GRID ARRAY | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388 | not_compliant | 3A991.A.2 | 8542.31.00.01 | BGA | 388 | NXP | |||||||||||||||
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S9KEAZ64AMLHR
NXP Semiconductors
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$3.2000 | Yes | Active | 32 | 48 MHz | 24 MHz | YES | 3 V | MICROCONTROLLER, RISC | CMOS | NO | NO | YES | YES | FLASH | 5.5 V | 2.7 V | AUTOMOTIVE | S-PQFP-G64 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | Tin (Sn) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | NXP SEMICONDUCTORS | QFP, | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||||||||||||||||
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LPC3131FET180
NXP Semiconductors
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Check for Price | Yes | Yes | Obsolete | 32 | 180 MHz | 25 MHz | YES | 1.2 V | MICROCONTROLLER, RISC | CMOS | ALSO REQUIRES 1.8V OR 3.3V SUPPLY | NO | YES | YES | YES | FLASH | 1.3 V | 1 V | INDUSTRIAL | S-PBGA-B180 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 180 | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 12 mm | NXP SEMICONDUCTORS | 12 X 12 MM, 0.80 MM PITCH, PLASTIC, SOT570-3, TFBGA-180 | compliant | 3A991.A.2 | 8542.31.00.01 | BGA | 180 | NXP | SOT-570-3 |