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CEC1302D-C0-SZ
 Microchip Technology Inc 		$0.0043 Yes Obsolete 32 48 MHz 32768 32768 8192 CORTEX-M4 32 32 48 MHz 116 6 YES 3.3 V MICROCONTROLLER CMOS YES NO YES FLOATING POINT YES NO YES 12 32 8 YES MROM 9.25 mA 3.465 V 3.3 V COMMERCIAL S-PBGA-B144 e1 3 70 °C 144 PLASTIC/EPOXY VFBGA BGA144,13X13,25 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 650 µm BOTTOM 800 µm 9 mm 9 mm WFBGA-144 144 WFBGA-144 3A991.a.2 8542.31.00.25 2016-03-23
PIC16LF1777-E/MV
 Microchip Technology Inc 		$0.0056 Yes Active 8 32 MHz 8192 1024 PIC16 32 MHz 36 10 YES 3 V MICROCONTROLLER, RISC CMOS NO YES NO FIXED POINT YES NO YES 1 8 14 YES FLASH 350 mA 3.6 V 2.5 V AUTOMOTIVE S-PQCC-N40 e3 1 125 °C -40 °C 40 PLASTIC/EPOXY HVQCCN LCC40,.2SQ,16 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 400 µm QUAD 550 µm 5 mm 5 mm UQFN-40 40 UQFN-40 3A991.a.2 8542.31.00.15
FS32K148HET0CLQT
 NXP Semiconductors 		$0.0132 Yes Active 32 80 MHz 2097152 262144 CORTEX-M4F 40 MHz 128 10 YES 3.3 V MICROCONTROLLER, RISC CMOS YES NO YES FLOATING POINT YES YES YES 16 8 8 8 YES FLASH 5.5 V 2.7 V S-PQFP-G144 3 85 °C -40 °C 260 ISO 26262-ASIL B 40 144 PLASTIC/EPOXY LFQFP QFP144,.87SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH GULL WING 500 µm QUAD 1.6 mm 20 mm 20 mm LQFP-144 3A991.a.2 8542.31.00.25
package
PIC16LF721-E/P
 Microchip Technology Inc 		$0.0158 Yes Active 8 16 MHz 4096 256 PIC16 16 MHz 18 4 NO 3.3 V MICROCONTROLLER, RISC CMOS NO NO NO FIXED POINT YES NO YES 1 1 14 YES FLASH 3.9 mA 3.6 V 1.8 V AUTOMOTIVE R-PDIP-T20 Not Qualified e3 125 °C -40 °C TS 16949 20 PLASTIC/EPOXY DIP DIP20,.3 RECTANGULAR IN-LINE Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 5.334 mm 7.62 mm 26.162 mm 0.300 INCH, LEAD FREE, PLASTIC, DIP-20 20 PDIP-20 EAR99 8542.31.00.01 DIP
package
SPC5748GSK1MKU6R
 NXP Semiconductors 		$0.0178 Yes Active 32 160 MHz 6291456 786432 E200Z4 40 MHz 96 115 YES 1.2 V MICROCONTROLLER, RISC CMOS EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE NO NO YES YES 32 8 NO FLASH 1.32 V 1.08 V AUTOMOTIVE S-PQFP-G176 125 °C -40 °C ISO 26262 176 PLASTIC/EPOXY HLFQFP SQUARE FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH GULL WING 500 µm QUAD 1.6 mm 24 mm 24 mm LQFP-176 3A991.a.2 8542.31.00.25 2018-03-16
package
PIC16LF1459-E/SS
 Microchip Technology Inc 		$0.0191 Yes Active 8 48 MHz 8192 1024 1024 PIC16 20 MHz 17 4 YES 3 V MICROCONTROLLER, RISC CMOS NO YES NO FIXED POINT YES NO YES 1 1 8 14 YES FLASH 107 mA 3.6 V 2.5 V AUTOMOTIVE R-PDSO-G20 e3 1 125 °C -40 °C 20 PLASTIC/EPOXY SSOP SSOP20,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH Matte Tin (Sn) GULL WING 650 µm DUAL 2 mm 5.3 mm 7.2 mm SSOP-20 20 SSOP-20 EAR99 8542.31.00.01
MKE04Z64VQH4
 NXP Semiconductors 		$0.0228 Yes Active 32 48 MHz 65536 8192 CORTEX-M0 24 MHz 58 13 YES 5 V MICROCONTROLLER, RISC CMOS NO NO NO FIXED POINT YES NO YES 2 3 8 8 YES FLASH 120 mA 5.5 V 2.7 V S-PQFP-G64 e3 3 105 °C -40 °C 260 40 64 PLASTIC/EPOXY QFP QFP64,.68SQ,32 SQUARE FLATPACK Tin (Sn) GULL WING 800 µm QUAD 2.45 mm 14 mm 14 mm QFP-64 3A991.A.2 8542.31.00.25
S9S12ZVLS3F0VFM
 NXP Semiconductors 		$0.0232 Yes Active 16 32 MHz 32768 1024 MC9S12ZVL 20 MHz 18 8 YES 5 V MICROCONTROLLER CMOS NO NO NO FIXED POINT YES NO YES 3 8 8 YES FLASH 25 mA 5.5 V 4.5 V INDUSTRIAL S-XQCC-N32 e3 3 105 °C -40 °C 260 ISO 26262 40 32 UNSPECIFIED HVQCCN LCC32,.2SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Tin (Sn) NO LEAD 500 µm QUAD 900 µm 5 mm 5 mm QFN-32 3A991.A.2 8542.31.00.01
S912ZVHY32F1VLQ
 NXP Semiconductors 		$0.0234 Yes Active 16 64 MHz 32768 2048 CPU12 32 32 20 MHz 100 YES 12 V MICROCONTROLLER CMOS YES YES YES FLASH 18 V 5.5 V INDUSTRIAL S-PQFP-G144 Not Qualified e3 3 105 °C -40 °C 260 AEC-Q100 40 144 PLASTIC/EPOXY LFQFP QFP144,.87SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH Tin (Sn) GULL WING 500 µm QUAD 20 mm 20 mm 3A991.A.2 8542.31.00.01
PIC16LF1579-E/P
 Microchip Technology Inc 		$0.0263 Yes Active 8 32 MHz 8192 1024 PIC16 32 MHz 18 7 NO 3 V MICROCONTROLLER, RISC CMOS NO YES NO FIXED POINT YES NO YES 1 1 8 14 YES FLASH 3.6 V 2.5 V AUTOMOTIVE R-PDIP-T20 e3 125 °C -40 °C TS 16949 20 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 5.334 mm 7.62 mm 26.162 mm DIP-20 20 PDIP-20 EAR99 8542.31.00.01
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