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MAX1608EEE+T
Analog Devices Inc
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Check for Price | Yes | Active | 8 | YES | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 0 | 5.5 V | 2.7 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 635 µm | DUAL | 1.73 mm | 3.9 mm | 4.89 mm | 16-QSOP-150_MIL | 16 | 16-QSOP-150_MIL | 2000-01-01 | Analog Devices | |||||||||||||
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MAX1608EEE+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 8 | YES | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 0 | 5.5 V | 2.7 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | MATTE TIN | GULL WING | 635 µm | DUAL | 1.73 mm | 3.9 mm | 4.89 mm | SOIC | 16 | MAXIM INTEGRATED PRODUCTS INC | SSOP, | compliant | EAR99 | 8542.39.00.01 | ||||||||||
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TMP68230P-8
Toshiba America Electronic Components
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Check for Price | Obsolete | NO | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 0 | 5.5 V | 4.5 V | R-PDIP-T48 | Not Qualified | 48 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 15.24 mm | 61.72 mm | DIP | 48 | TOSHIBA CORP | DIP, | unknown | EAR99 | 8542.39.00.01 | |||||||||||||||||||||
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MAX1609EEE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 8 | YES | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 0 | 5.5 V | 2.7 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | TIN LEAD | GULL WING | 635 µm | DUAL | 1.75 mm | 3.9 mm | 4.9 mm | SSOP | 16 | MAXIM INTEGRATED PRODUCTS INC | 0.150 INCH, 0.025 INCH PITCH, MO-137D, QSOP-16 | not_compliant | EAR99 | 8542.39.00.01 | ||||||||||||
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BU8272GUW-E2
ROHM Semiconductor
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Check for Price | Yes | Yes | Obsolete | 20 | 400 kHz | 20 | YES | 1.8 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 0 | 1.95 V | 1.65 V | S-PBGA-B35 | Not Qualified | NOT SPECIFIED | NOT SPECIFIED | 35 | PLASTIC/EPOXY | VFBGA | BGA35,6X6,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 900 µm | 4 mm | 4 mm | BGA | 35 | ROHM CO LTD | VFBGA, BGA35,6X6,20 | compliant | EAR99 | 8542.39.00.01 | |||||||||||||
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MAX1608EEE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 8 | YES | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 0 | 5.5 V | 2.7 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | TIN LEAD | GULL WING | 635 µm | DUAL | 1.75 mm | 3.9 mm | 4.9 mm | SSOP | 16 | MAXIM INTEGRATED PRODUCTS INC | 0.150 INCH, 0.025 INCH PITCH, MO-137D, QSOP-16 | not_compliant | EAR99 | 8542.39.00.01 | ||||||||||||
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MAX1609EEE+
Analog Devices Inc
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Check for Price | Yes | Active | 8 | YES | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 0 | 5.5 V | 2.7 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 635 µm | DUAL | 1.73 mm | 3.9 mm | 4.89 mm | 16-QSOP-150_MIL | 16 | 16-QSOP-150_MIL | 2000-01-01 | Analog Devices | |||||||||||||
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MAX1608EEE
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 8 | YES | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 0 | 5.5 V | 2.7 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 16 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | TIN LEAD | GULL WING | 635 µm | DUAL | 1.73 mm | 3.9 mm | 4.89 mm | SSOP | 16 | MAXIM INTEGRATED PRODUCTS INC | 0.150 INCH, 0.025 INCH PITCH, MO-137D, QSOP-16 | not_compliant | EAR99 | 8542.39.00.01 | |||||||||||
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KU82961KA-16
Intel Corporation
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Check for Price | No | Obsolete | 32 | 32 MHz | YES | 5 V | PARALLEL IO PORT, PRINTER INTERFACE | MOS | 0 | 200 mA | 5.5 V | 4.5 V | OTHER | S-PQFP-G132 | Not Qualified | e0 | 85 °C | 132 | PLASTIC/EPOXY | QFP | SPQFP132,1.1SQ | SQUARE | FLATPACK | TIN LEAD | GULL WING | 635 µm | QUAD | 4.57 mm | 24.13 mm | 24.13 mm | QFP | 132 | INTEL CORP | QFP, SPQFP132,1.1SQ | compliant | EAR99 | 8542.39.00.01 | ||||||||||||
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MAX1609EEE+
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 8 | YES | 5 V | PARALLEL IO PORT, GENERAL PURPOSE | CMOS | 0 | 5.5 V | 2.7 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | MATTE TIN | GULL WING | 635 µm | DUAL | 1.73 mm | 3.9 mm | 4.89 mm | SOIC | 16 | MAXIM INTEGRATED PRODUCTS INC | SSOP, | compliant | EAR99 | 8542.39.00.01 |