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CDLL6677
Microsemi Corporation
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$6.4103 | No | No | Transferred | 200 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 40 V | 1 | SCHOTTKY | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA | HERMETIC SEALED, GLASS, LL34, MELF-2 | 2 | not_compliant | EAR99 | 8541.10.00.70 | Microsemi Corporation | |||||||||
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CDLL6675
Compensated Devices Inc
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Check for Price | Transferred | 200 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 20 V | 1 | SCHOTTKY | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 125 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | |||||||||||||||
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CDLL6675
Microchip Technology Inc
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$2.6559 | No | Active | 200 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | SCHOTTKY | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | Microchip | |||||||||||||||
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MLL6650
Microsemi Corporation
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Check for Price | No | Obsolete | 1 A | 550 mV | SILICON | RECTIFIER DIODE | SINGLE | YES | 45 V | 1 | SCHOTTKY | FREE WHEELING DIODE | 50 A | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500/586 | DO-213AB | 150 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | unknown | EAR99 | 8541.10.00.80 | |||||||||
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CDLL6677
Microchip Technology Inc
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$6.4182 | No | Active | 200 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 40 V | 1 | SCHOTTKY | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | |||||||||||||||
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CDLL6676-TR
Microsemi Corporation
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Check for Price | No | Transferred | 200 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | SCHOTTKY | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | DO-213AA | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA | HERMETIC SEALED, GLASS, LL34, MELF-2 | 2 | compliant | EAR99 | 8541.10.00.70 | |||||||||||
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CDLL6675
Microsemi Corporation
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$2.6418 | No | No | Transferred | 200 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | SCHOTTKY | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA | HERMETIC SEALED, GLASS, LL34, MELF-2 | 2 | unknown | EAR99 | 8541.10.00.70 | |||||||||||
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CDLL6676
Compensated Devices Inc
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Check for Price | Transferred | 200 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 30 V | 1 | SCHOTTKY | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 125 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | |||||||||||||||
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CDLL6677
Compensated Devices Inc
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Check for Price | Transferred | 200 mA | SILICON | RECTIFIER DIODE | SINGLE | YES | 40 V | 1 | SCHOTTKY | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 125 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | |||||||||||||||
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LL6650
Microsemi Corporation
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Check for Price | Transferred | 1 A | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | SCHOTTKY | HIGH SURGE CAPABILITY | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 150 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.80 |