Parametric results for: MAX-7W-0 under Cellular Telephone Circuits

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HMC687LP4
Hittite Microwave Corp
Check for Price No No Transferred 5 V BICMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-XQCC-N24 e0 Not Qualified 1 85 °C -40 °C 235 24 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES TIN LEAD NO LEAD 500 µm QUAD 4 mm 4 mm 1 mm HITTITE MICROWAVE CORP QFN HVQCCN, 24 compliant EAR99 8542.39.00.01
MRFIC0954R2
NXP Semiconductors
Check for Price Obsolete 3.3 V BICMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PDSO-G20 85 °C -40 °C 20 PLASTIC/EPOXY HTSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 6.5 mm 1.2 mm NXP SEMICONDUCTORS HTSSOP, unknown 8542.39.00.01
MAX2058ETL-T
Maxim Integrated Products
Check for Price No No Obsolete 5 V BICMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-XQCC-N40 Not Qualified 1 85 °C -40 °C 40 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 6 mm 6 mm 800 µm MAXIM INTEGRATED PRODUCTS INC QFN 6 X 6 MM, QFN-40 40 not_compliant 8542.39.00.01
MRFIC1854AR2
Motorola Semiconductor Products
Check for Price No Obsolete 2.7 V BICMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PDSO-G20 e0 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 6.5 mm 1.2 mm MOTOROLA INC TSSOP, unknown 8542.39.00.01
HMC689LP4
Analog Devices Inc
Check for Price No Active 5 V BICMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-PQCC-N24 e0 Not Qualified 1 85 °C -40 °C 24 PLASTIC/EPOXY HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Tin/Lead (Sn/Pb) NO LEAD 500 µm QUAD 4 mm 4 mm 1 mm ANALOG DEVICES INC QFN-24 compliant EAR99 8542.39.00.01
UAA3580HN
NXP Semiconductors
Check for Price Obsolete 1.8 V BICMOS RF AND BASEBAND CIRCUIT 1 63 µA OTHER S-PQCC-N24 e3/e4 Not Qualified 70 °C -30 °C 24 PLASTIC/EPOXY HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES TIN/NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 4 mm 4 mm 1 mm NXP SEMICONDUCTORS QFN 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, SOT-616-1, HVQFN-24 24 compliant 8542.39.00.01
LV2700V
SANYO Electric Co Ltd
Check for Price No Obsolete 3 V BICMOS BASEBAND CIRCUIT 1 16 µA COMMERCIAL EXTENDED R-PDSO-G30 e0 Not Qualified 75 °C -20 °C 30 PLASTIC/EPOXY LSSOP SSOP30,.3 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 5.6 mm 9.95 mm 1.7 mm SANYO ELECTRIC CO LTD SSOP LSSOP, SSOP30,.3 30 unknown 8542.39.00.01
ADL5363XCPZ-R7
Analog Devices Inc
Check for Price Yes Yes Obsolete 5 V BICMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-XQCC-N20 e3 85 °C -40 °C 20 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 650 µm QUAD 5 mm 5 mm 900 µm ANALOG DEVICES INC QFN 5 X 5 MM, ROHS COMPLIANT, MO-220VHHC, LFCSP-20 20 unknown 8542.39.00.01
MC13760
Motorola Semiconductor Products
Check for Price Obsolete 2.775 V BICMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL S-PBGA-B104 Not Qualified 85 °C -40 °C 104 PLASTIC/EPOXY LFBGA BGA104,11X11,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 10 mm 10 mm 1.6 mm MOTOROLA INC LFBGA, BGA104,11X11,32 unknown 8542.39.00.01
MRFIC1854R2
Motorola Semiconductor Products
Check for Price No Obsolete 2.7 V BICMOS RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PDSO-G20 e0 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 6.5 mm 1.2 mm MOTOROLA INC TSSOP, unknown 8542.39.00.01